Influence of Surface Preparation on Thermal Contact Conductance of Stainless Steel and Aluminum

Parmenter, Kelly E.; Marschall, E.

doi:10.1080/08916159508946501

Cited by 9 publications

(3 citation statements)

References 7 publications

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“…This can be attributed to higher effective contact area in comparison to the apparent area. More or less this result matches with Gmelin [6] and Parmenter [7]. Gmelin reported that roughness controls the contact quality at high pressure, and added that it is commonly believed that rough surfaces have lower conductance.…”

Section: Effect Of Roughnesssupporting

confidence: 84%

Modeling of Transient Thermal Contact Resistance out of Conjugate Gradient Method

Elsabbagh¹,

Fieberg²,

El-Magd³

et al. 2007

Materialwissenschaft Werkst

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Temperature profile at contacting pairs of any material combination is crucial in many engineering applications. A new experimental approach is suggested to estimate the contact heat transfer coefficient as well as the thermal contact resistance. This method is based on temperature infrared measurements of contact bodies and then solve the inverse problem with conjugate gradient method. Different affecting parameters are studied namely; surface roughness, presence of interlayer, applied pressure and bodies temperature difference. The time dependant heat transfer coefficients resulting from the proposed method need to be validated by a computer model. Close results are shown with slight deviation by the increase of the applied pressure and the temperature difference.

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Section: Effect Of Roughnesssupporting

confidence: 84%

Modeling of Transient Thermal Contact Resistance out of Conjugate Gradient Method

Elsabbagh¹,

Fieberg²,

El-Magd³

et al. 2007

Materialwissenschaft Werkst

View full text Add to dashboard Cite

show abstract

“…of 2 from these values, but the air/vacuum trend is always the same. All these numbers are significantly greater than those seen with traditional interfaces, even compared with metalmetal structures [17][18][19][20].…”

Section: Interface Heat Transfermentioning

confidence: 79%

Thermal and mechanical phenomena in micromechanical optics

Talghader

2004

J. Phys. D: Appl. Phys.

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As the size of mechanical devices decreases and their power-handling specifications increase, thermal effects will become more and more important. This article is a basic survey of some of the most commonly seen thermal effects in micromechanical optics. The fundamental heat transfer mechanisms of conduction, convection, and radiation are quickly reviewed in regard to typical micromirror-type plates, and a simple measurement technique to extract thermal conductance is described. Interface thermal conductance is discussed in the light of recent experimental results on actuated micromechanical structures and squeeze-film theory. A new class of devices with tunable thermal conductance using controlled interface contact is discussed. Of particular interest are thermal IR detectors with extended dynamic range. Thermal expansion deformation is particularly detrimental to optics with two or more thin film layers. This is described in terms of an analytical elastic model, but the limitations of this are discussed in light of recent research. The model leads to a method for controlling thermal deformation, and micromirror devices are shown that are thermally invariant within λ/60 over at least 37°C. Finally, thermal fluctuation noise is described and shown to limit the finesse of high performance micromachined optical cavities and degrade the sensitivity of thermal nanomechanical detectors.

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“…The thermal contact conductance between the steel disc and the aluminium adaptor is assumed to be h=1000 W/m 2 °C for the test at ambient temperature, according to [17][18][19]. However, for the tests at elevated temperatures, an insulator between the disc and the aluminium adaptor is used.…”

Section: Heat Partitioningmentioning

confidence: 99%

Temperature and thermoelastic instability at tread braking using cast iron friction material

Abbasi

Teimourimanesh

Vernersson

et al. 2014

Wear

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Braking events in railway traffic often induce high frictional heating and thermoelastic instability (TEI) at the interfacing surfaces. In the present paper, two approaches are adopted to analyse the thermomechanical interaction in a pin-on-disc experimental study of railway braking materials. In a first part, the thermal problem is studied to find the heat partitioning between pin and disc motivated by the fact that wear mechanisms can be explained with a better understanding of the prevailing thermal conditions. The numerical model is calibrated using the experimental results. In a second part, the frictionally induced thermoelastic instabilities at the pin-disc contact are studied using a numerical method and comparing them with the phenomena observed in the experiments. The effects of temperature on material properties and on material wear are considered. It is found from the thermal analysis that the pin temperature and the heat flux to the pin increase with increasing disc temperatures up to a transition stage. This agrees with the behaviour found in the experiments. Furthermore, the thermoelastic analysis displays calculated pressure and the temperature distributions at the contact interface that are in agreement with the hot spot behaviour observed in the experiments. KEYWORDSRailway tread braking, frictional heating, heat partitioning, thermoelastic instability (TEI), hot spots, pin-on-disc test, numerical analysis.

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Influence of Surface Preparation on Thermal Contact Conductance of Stainless Steel and Aluminum

Cited by 9 publications

References 7 publications

Modeling of Transient Thermal Contact Resistance out of Conjugate Gradient Method

Modeling of Transient Thermal Contact Resistance out of Conjugate Gradient Method

Thermal and mechanical phenomena in micromechanical optics

Temperature and thermoelastic instability at tread braking using cast iron friction material

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