Influence of surface modified graphene oxide on the mechanical performance and curing kinetics of epoxy resin

Li, Lü; Liao, Xia; Sheng, Xingyue; Liu, Pan; Zhang, Hao; He, Leilei; Geng, Qin

doi:10.1002/pat.4913

Cited by 19 publications

(16 citation statements)

References 46 publications

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“… E a value can be calculated through the Kissinger model without any pre‐assumption about the reaction mechanism, according to Equation (5) 35,36 :

d ([], \ln ((), β / T_{P}^{2})) / d ([], (1 / T_{P})) = - ((), E_{a} / italicRT),

where β is the heating rate used in the dynamic DSC experiments and T p is the exothermic peak temperature. The values of E a were easily obtained from the slope of plots

\ln ((), β / T_{P}^{2})

versus (1/ T P ) in Figure 5 and summarized in Table 3.…”

Section: Resultsmentioning

confidence: 99%

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Khalafi

Ehsani

Khonakdar

2020

Polymers for Advanced Techs

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2,2′‐Dithiobisethanamine (cystamine), an aliphatic diamine containing exchangeable disulfide bonds, was used as the curing agent for epoxy resin. The dynamic curing kinetics and thermal stability of the epoxy/cystamine system were investigated by DSC and TGA analysis. Applied the Málek method, the Sestak–Berggren autocatalytic equation was selected to describe the cure kinetics of the epoxy/cystamine system. The results showed that the Šesták– Berggren equation is in good agreement with the experimental data. The activation energy of the curing reaction was 56.2 and 53.6 kJ mol −1, respectively, calculated by Kissinger and KAS models. Also, the glass transition temperature for the epoxy/cystamine system was slightly than that of the commonly used epoxy‐diamine systems. Moreover, the thermal degradation of the cured epoxy/cystamine network was observed at temperatures above 283°C. Further, the results obtained from the epoxy/cystamine system were compared with those obtained from the epoxy/diethylenetriamine system. All the above results suggest that cystamine has the potential to be used as the curing agent for epoxy systems.

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“… E a value can be calculated through the Kissinger model without any pre‐assumption about the reaction mechanism, according to Equation (5) 35,36 :

d ([], \ln ((), β / T_{P}^{2})) / d ([], (1 / T_{P})) = - ((), E_{a} / italicRT),

where β is the heating rate used in the dynamic DSC experiments and T p is the exothermic peak temperature. The values of E a were easily obtained from the slope of plots

\ln ((), β / T_{P}^{2})

versus (1/ T P ) in Figure 5 and summarized in Table 3.…”

Section: Resultsmentioning

confidence: 99%

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Khalafi

Ehsani

Khonakdar

2020

Polymers for Advanced Techs

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“…The displayed similar reverse curves for both neat epoxy and epoxy composites demonstrate the autocatalytic curing behaviors of the epoxy resin and epoxy composites, which are not affected by the incorporation of DFGO. [42][43][44] Furthermore, a higher curing degree of epoxy composites than that of the neat epoxy through the curing process is evident, indicating the promotion effect of DFGO on the curing process.…”

Section: Thermal Analysis Of Epoxy Composites With Dfgomentioning

confidence: 95%

The correlated effects of polyetheramine-functionalized graphene oxide loading on the curing reaction and the mechanical properties of epoxy composites

Tian

Yang

et al. 2021

High Performance Polymers

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In this study, the effects of polyetheramine (D230) functionalized graphene oxide loading on the curing reaction, thermal and mechanical properties of epoxy composites were studied and the correlation between structure and property of epoxy composite was established. In the functionalization of graphene oxide (GO), the effect of the mass ratio of D230 to GO on chemical properties of the functionalized GO was investigated. Results showed that D230 were successfully covalently grafted onto surface of two-dimensional functionalized GO sheet. The functionalized GO sheets prepared under optimal condition of D230/GO ratio of 1:1 dispersed evenly in epoxy composites, indicating the possibility of the epoxy composite fabrication by the solvent-free technique. The analysis of qualitative Cure Index suggested that epoxy composites were subjected to excellent curing. The quantitative evaluation of curing kinetics demonstrated that the functionalized GO exhibited a chemical facilitation on the curing reaction. However, the functionalized GO simultaneously physically restricted the curing reactivity, especially at high loading. These contributed to the improved interfacial properties and high toughness of the epoxy composites. Compared to neat epoxy, the epoxy composites showed effective tensile strength improvement of ∼10.0% (77.0 MPa), tensile modulus enhancement of ∼7.7% (3.34 GPa), flexural modulus increment of ∼12.1% (3.43 GPa), and flexural strength increment of ∼10.6% (124.3 MPa). This study demonstrated an effective and environment-friendly strategy to design GO reinforced epoxy composites with favorable dispersion and interfacial bonding, and it further clarified the relationship between the crosslinking network/interfacial structure and the mechanical properties of epoxy composites.

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“…Among various techniques such as differential scanning calorimetry (DSC), Raman spectroscopy, and Fourier transform infrared (FTIR), which can investigate the curing behavior of epoxy, isothermal 23–26 and non‐isothermal 27–30 DSC analyses have been used more frequently because these analyses can be directly related to the degree of conversion. Various kinetic models have been utilized to investigate the cure kinetics of epoxy, including Ozawa, 31,32 Kissinger, 33 Flynn‐Wall‐Ozawa, 34 Kissinger‐Akahira‐Sunose (KAS), 35 autocatalytic, 36 isoconversional, 37 Borchardt‐Daniels, 38 and Kamal 39 methods.…”

Section: Introductionmentioning

confidence: 99%

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Mousavi

Estaji

Rostami

et al. 2021

Polymers for Advanced Techs

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A novel green surface modification was successfully implemented on alumina nanoparticles using chitosan (CS) to prevent nanoparticles' aggregation. To evaluate the surface changes of nanoparticles, FTIR, TGA, TEM, and SEM analyses were used. The cure kinetics of the uncured samples was analyzed by DSC. Different methods such as KAS, Friedman, Starink, and FWO were applied to measure the activation energy. The activation energy of epoxy reinforced with chitosan‐functionalized alumina (epoxy/[CS‐EPO‐alumina]) was less than that of epoxy reinforced with alumina (epoxy/alumina), which was a confirmation of the positive effect of CS on curing reaction kinetics. Using the Malek method, the Sestak‐Berggren autocatalytic equation was chosen to investigate the cure kinetics of the epoxy. It was found that the Sestak‐Berggren equation is well matched with the experimental data and the model was suitable to predict the epoxy curing reaction reliably. Moreover, the glass transition temperatures of all samples were approximately the same. The effect of surface modification of alumina on the electrical insulating behavior of epoxy was also studied. It was found that CS functionalized alumina (CS‐EPO‐alumina) increased volume resistivity of epoxy at a temperature range of 30 to 80°C more than that of alumina. Electric stability and breakdown strength of epoxy/alumina and epoxy/(CS‐EPO‐alumina) also enhanced, where epoxy/(CS‐EPO‐alumina) experienced a further increase compared to epoxy.

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Influence of surface modified graphene oxide on the mechanical performance and curing kinetics of epoxy resin

Cited by 19 publications

References 46 publications

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

The correlated effects of polyetheramine-functionalized graphene oxide loading on the curing reaction and the mechanical properties of epoxy composites

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

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