Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Khalafi, Hamid Reza; Ehsani, Morteza; Khonakdar, Hossein Ali

doi:10.1002/pat.5174

Cited by 24 publications

(21 citation statements)

References 48 publications

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“…The results of non‐isothermal DSC tests are also listed in Table 1. As observed, regardless of the type of sample, the peak temperature was enhanced by increasing the heating rate and the curing reaction occurred at higher temperatures, which is in line with previous works 64 . The thermograms of all samples in each of three heating rates are in a symmetrical thermocouple, suggesting that no processes such as thermal changes or any side reactions have taken place.…”

Section: Resultssupporting

confidence: 91%

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Mousavi

Estaji

Rostami

et al. 2021

Polymers for Advanced Techs

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A novel green surface modification was successfully implemented on alumina nanoparticles using chitosan (CS) to prevent nanoparticles' aggregation. To evaluate the surface changes of nanoparticles, FTIR, TGA, TEM, and SEM analyses were used. The cure kinetics of the uncured samples was analyzed by DSC. Different methods such as KAS, Friedman, Starink, and FWO were applied to measure the activation energy. The activation energy of epoxy reinforced with chitosan‐functionalized alumina (epoxy/[CS‐EPO‐alumina]) was less than that of epoxy reinforced with alumina (epoxy/alumina), which was a confirmation of the positive effect of CS on curing reaction kinetics. Using the Malek method, the Sestak‐Berggren autocatalytic equation was chosen to investigate the cure kinetics of the epoxy. It was found that the Sestak‐Berggren equation is well matched with the experimental data and the model was suitable to predict the epoxy curing reaction reliably. Moreover, the glass transition temperatures of all samples were approximately the same. The effect of surface modification of alumina on the electrical insulating behavior of epoxy was also studied. It was found that CS functionalized alumina (CS‐EPO‐alumina) increased volume resistivity of epoxy at a temperature range of 30 to 80°C more than that of alumina. Electric stability and breakdown strength of epoxy/alumina and epoxy/(CS‐EPO‐alumina) also enhanced, where epoxy/(CS‐EPO‐alumina) experienced a further increase compared to epoxy.

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Section: Resultssupporting

confidence: 91%

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Mousavi

Estaji

Rostami

et al. 2021

Polymers for Advanced Techs

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“…As shown in Figure 4a,b, the activation energy (∆ E ) of Ozawa and Kissinger were confirmed by Equations () and (), 31 which were listed in Table 2. Same result as curing temperature, there is no obvious difference in ∆ E .

Δ E = \frac{- R}{1.052} \cdot \frac{Δ \ln β}{Δ (1 / T_{P})},

\frac{d [\ln (β / T_{P}^{2})]}{d (1 / T_{P})} = - \frac{Δ E}{R},

here the R is the perfect gas constant, 8.314 J/(mol K), the β is the heating rate, K/min.…”

Section: Resultsmentioning

confidence: 57%

“…As shown in Figure 4a,b, the activation energy (ΔE) of Ozawa and Kissinger were confirmed by Equations ( 1) and ( 2), 31 which were listed in Table 2. Same result as curing temperature, there is no obvious difference in ΔE.…”

Section: The Determination Of Curing Processmentioning

confidence: 58%

High heat‐resistant (250°C) epoxy resin composites with excellent dielectric properties

Wang

Feng

Zhang

et al. 2022

J of Applied Polymer Sci

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Insulated gate bipolar transistor (IGBT) is the core of electric energy conversion and circuit control, which is widely used in the field of electric vehicles. Higher service temperature, higher power density, and higher operating voltage are the tendency for IGBT in which packing materials have to possess more stable temperature resistance and better insulating properties. In this work, cyanate ester (CE) and polyhedral oligomeric silsesquioxanes (POSS) are introduced into epoxy with various filling ratio to improve the dielectric and thermal properties. The curing process of every system is determined by non‐isothermal differential scanning calorimetry (DSC). N and Si element distribution mappings indicate that there are good compatibility between POSS, CE, and epoxy. The dielectric test shows that the dielectric constant decreases from 4.34 to 2.84 at 1 MHz and from 4.76 to 2.93 at 1 kHz when the filling ratio is 60 wt%. Meanwhile, the DC breakdown strength increases from 172.7 to 286.4 kV/mm. Furthermore, the glass transition temperature (Tg) increases from 180 to 263°C and the yield of residual carbon increases from 6.2% to 23.7%. A new packing material, which can endure 250°C of operating temperature and has excellent dielectric properties has been synthesized.

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“…Therefore, choosing a suitable curing agent and designing reasonable heat curing procedures to control process parameters is the key to ensure product quality. [13][14][15] Huang et al 16 prepared an epoxy prepolymer containing bismaleimide (BMI) and 3-aminophenoxy phthalonitrile (3-APN). The corresponding curing behavior was investigated by differential scanning calorimetry (DSC) and dynamic rheological analysis.…”

Section: Introductionmentioning

confidence: 99%

Effect of new nonionic curing agent on curing kinetics and mechanical properties of epoxy resin

Chai

Wang

Yang

et al. 2021

Polymers for Advanced Techs

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The current research work presents a novel nonionic curing agent (AEDA) synthesized by utilizing ethylene glycol diglycidyl ether (EGDE), 3,4‐dimethoxyaniline (DI), and triethylenetetramine (TETA). Infrared spectroscopy and nuclear magnetic resonance spectroscopy were used to characterize the structure of AEDA curing agent. Non‐isothermal scanning calorimetry was used to determine the activation energy and curing conditions of epoxy resin in the curing process. An impact testing machine, a tensile testing machine and a scanning electron microscope (SEM) were used to analyze the impact strength, tensile strength, bending strength, and micromorphology of the AEDA/E‐51 system with different mass ratios. The results show that AEDA is an effective high‐temperature curing agent. For the AEDA/E‐51 system with the optimal mass ratio of 10:100, the best curing temperature is 92.15°C, and the post‐curing temperature is 135.65°C. Furthermore, the apparent activation energy (Ea) of 1670 J/mol, the pre‐exponential factor (A) of 3.7 × 10−4, and the reaction series (n) value of 0.76 are obtained for the AEDA/E‐51 system. The impact strength of AEDA/E‐51 epoxy resin polymer is 7.82 kJ/m2, tensile strength is 14.2 MPa, and bending strength is 18.92 MPa. The micromorphological results of the AEDA/E‐51 system are consistent with the results of DSC test and mechanical properties test. Hence, this study provides theoretical support for the practical applications of AEDA as curing agent.

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Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Cited by 24 publications

References 48 publications

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

High heat‐resistant (250°C) epoxy resin composites with excellent dielectric properties

Effect of new nonionic curing agent on curing kinetics and mechanical properties of epoxy resin

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