“…Differently, in epitaxial GaN, compressive stress generally dominates, because of the larger thermal expansion coefficient of sapphire. 51,[56][57][58][59][60] Large compressive stresses were also reported in films deposited by RF sputtering for substrate temperatures below 500 C. 25 Both the previous literature 39-41,51,52,56,61 and our analysis of the data in the present study indicate that the observed lattice swelling (with changes in both a and c parameters of the GaN hexagonal cell) can be attributed to three main factors: (i) the coalescence/merging of the crystallites/interfaces; 56 (ii) the loss of film material during and after growth; and (iii) impingement of energetic N and the corresponding creation of selfinterstitials. 34,41,52,62,63 These points are discussed in more detail in the following.…”