1967
DOI: 10.1016/0039-6028(67)90117-3
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Influence of space-charge on potential barrier in field emission

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1973
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Cited by 7 publications
(2 citation statements)
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“…The high trap density in conventional top contacted memory cells may come from both electronic traps generated from electron-beam lithography and also lattice disorders caused by depositing top metal contact (Supplementary Note 14 ). Since the response time of these trap states lag significantly behind of the applied 10–100 ns pulse duration for ultrafast P/E operation, they act as fixed space charges that increase the potential barrier for charge injection 39 . The additional capacitance related to interfacial trap states also tend to reduce the potential drop in MoS 2 , thus counteracts the barrier lowering for hot carrier injection.…”
Section: Resultsmentioning
confidence: 99%
“…The high trap density in conventional top contacted memory cells may come from both electronic traps generated from electron-beam lithography and also lattice disorders caused by depositing top metal contact (Supplementary Note 14 ). Since the response time of these trap states lag significantly behind of the applied 10–100 ns pulse duration for ultrafast P/E operation, they act as fixed space charges that increase the potential barrier for charge injection 39 . The additional capacitance related to interfacial trap states also tend to reduce the potential drop in MoS 2 , thus counteracts the barrier lowering for hot carrier injection.…”
Section: Resultsmentioning
confidence: 99%
“…Since the response time of these trap states lag significantly behind of the applied 10-100 ns pulse duration for ultrafast P/E operation, they act as fixed space charges that increase the potential barrier for charge injection. 39 The additional capacitance related to interfacial trap states also tend to reduce the potential drop in MoS2, thus counteracts the barrier lowering for hot carrier injection. In present float gate memory cells, the reduced trap density in edge contact renders highly tunable Schottky barrier under gate modulation (Supplementary information S13), which is essential for hot carrier injection via Schottky emission at the metalsemiconductor interface.…”
Section: Edge Contact Facilitated Charge Tunneling Injection To Float...mentioning
confidence: 99%