Influence of Solder Pads to PERC Solar Cells for Module Integration

Kiefer, Fabian; Brendemühl, Till; Berger, M. N.; Lohse, Anja; Kirstein, Sabine; Braun, Nadja; Lehr, Martin; Heinemeyer, Frank; Jung, Verena; Morlier, Arnaud; Blankemeyer, Susanne; Kunze, I.; Winter, Renate; Harder, Nils‐Peter; Dullweber, Thorsten; Köntges, Marc; Brendel, Rolf

doi:10.1016/j.egypro.2013.07.291

Cited by 13 publications

(6 citation statements)

References 2 publications

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“…This is implied by the pattern of relatively high luminescence intensity between solder pads upon degradation. When imaged from the front side of the module, back‐side solder pads typically appear dark due to decreased passivation quality when Ag pads are applied 46,47 . When imaging from the back side of the module, we see additional metallization surrounding the back‐side solder pads (likely Al to create a local BSF 46,47 ), creating vertical bus bars on the back side of the cell (see Figure 5, lower left).…”

Section: Resultsmentioning

confidence: 99%

“…When imaged from the front side of the module, back-side solder pads typically appear dark due to decreased passivation quality when Ag pads are applied. 46,47 When imaging from the back side of the module, we see additional metallization surrounding the back-side solder pads (likely Al to create a local BSF 46,47 ), creating vertical bus bars on the back side of the cell (see Figure 5, lower left). After degradation, the regions containing backside Al metallization, but no back-side solder pads, appear bright in the front-side PL imaging.…”

Section: Positive Bias Damp Heatmentioning

confidence: 99%

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Electrochemical degradation modes in bifacial silicon photovoltaic modules

Sulas‐Kern

Owen‐Bellini

Ndione

et al. 2021

Progress in Photovoltaics

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Motivated by the rapidly rising deployment of bifacial monocrystalline‐silicon photovoltaics (PV), we investigate the durability of various PV module packaging configurations with transparent coverings on both the front and rear sides of the module. We use a series of bifacial passivated emitter and rear cell (p‐PERC) mini‐modules with systematically varying outer cover materials (glass/glass, G/G, or glass/transparent backsheet, G/TB) and encapsulant chemistries (poly [ethylene‐co‐vinyl acetate], EVA; or polyolefin, POE). We study degradation modes over 1,000 hours of combined damp heat (DH) exposure and high system voltages that can cause potential‐induced degradation (PID) under positive, zero, or negative 1,000 V cell‐to‐frame bias. We analyze the degradation modes using a combination of current–voltage measurements, impedance spectroscopy, external quantum efficiency, and spatially resolved luminescence and thermal imaging. Our results highlight various types of degradation including shunting, enhanced recombination, and series resistance increases, and we use spatially resolved characterization to separately identify the localized effects. We show that multiple PID and moisture‐ingress degradation modes severely affect EVA‐containing modules, with previously reported PID processes under negative‐bias DH and a unique observation of rear‐side surface recombination in G/EVA/G modules under positive‐bias DH. We observe significantly less degradation in POE‐containing modules, where the G/POE/G configuration exhibits minimal degradation under all stress conditions that we employ.

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Section: Resultsmentioning

confidence: 99%

Section: Positive Bias Damp Heatmentioning

confidence: 99%

Electrochemical degradation modes in bifacial silicon photovoltaic modules

Sulas‐Kern

Owen‐Bellini

Ndione

et al. 2021

Progress in Photovoltaics

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“…This is reported as being less harmful to cell performance for PERC cells [46], since the area of high recombination velocity contact between the Ag layer and substrate is much smaller in this case, occurring only where there are openings in the rear dielectric. Contact between the pads and the Al rear metallisation areas occur through carefully controlled overlap regions [47].…”

Section: Production Sequences and Costingsmentioning

confidence: 93%

The Passivated Emitter and Rear Cell (PERC): From conception to mass production

Green

2015

Solar Energy Materials and Solar Cells

368

178

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“…The dimension and number of the Ag pads are optimized with respect to the soldering process and the long‐term stability of the interconnection. The impact on the electric performance of the solar cells can be neglected 144 . In the second step, the surrounding area of the backside with exception of a narrow edge region is coated by screen printing of Al paste, which is particularly unsophisticated from a printer's point of view.…”

Section: Solar Cell Metallization: Fundamental Aspects and Requirementsmentioning

confidence: 99%

“…The impact on the electric performance of the solar cells can be neglected. 144 In the second step, the surrounding area of the backside with exception of a narrow edge region is coated by screen printing of Al paste, which is particularly unsophisticated from a printer's point of view. However, both printing steps require a stable and well-controlled application of a defined wet paste layer thickness within a defined production tolerance, which is determined by the selection of the screen mesh (see Section 3.5), the paste rheology (see Section 4), and-to a small extend-by the selected printing parameters (see Section 3.2).…”

Section: Rear Side Metallizationmentioning

confidence: 99%

Printing technologies for silicon solar cell metallization: A comprehensive review

Tepner

Lorenz

2023

Progress in Photovoltaics

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This paper presents a comprehensive overview on printing technologies for metallization of solar cells. Throughout the last 30 years, flatbed screen printing has established itself as the predominant metallization process for the mass production of silicon solar cells. For this reason, we will provide a detailed review on its history, its evolution over time, and how the continuous efforts of the scientific and industrial community for further improvements revolutionized the entire PV industry. Furthermore, we will guide the reader through the physics on silicon solar cell metallization, the fundamentals on contact formation, and what type of challenges and requirements these topics create for printing technologies. The main topic of this review addresses the flatbed screen-printing process mechanics, its different process sequences, corresponding screen technology, and the very important impact of paste rheology on the printing result. Finally, we will compare alternative upcoming printing approaches to flatbed screen printing and discuss how they might solve upcoming challenges in metallization in terms of increasing the throughput rates at an everdecreasing grid line width and reduced silver consumption.

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Influence of Solder Pads to PERC Solar Cells for Module Integration

Cited by 13 publications

References 2 publications

Electrochemical degradation modes in bifacial silicon photovoltaic modules

Electrochemical degradation modes in bifacial silicon photovoltaic modules

The Passivated Emitter and Rear Cell (PERC): From conception to mass production

Printing technologies for silicon solar cell metallization: A comprehensive review

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