Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

Abstract

In the present study, different weight percentages of Sb nanoparticles (100-120 nm) ranging from 0 to 1.5 wt% were added to Sn-9Zn eutectic solder alloy to investigate the effect of third element addition on the microstructure, mechanical properties as well as thermal behavior of the newly developed composite solder alloys.The results indicate that the Sb nano-particle based intermetallic compounds (IMC) were found uniformly distributed, refined the microstructure and formed IMC particles in the eutectic solder alloy. After the addition of nano Sb particles in Sn-9Zn solder, fine a-Zn phase and e-Sb 3 Zn 4 IMC particles were clearly observed in the b-Sn matrix. The e-Sb 3 Zn 4 IMC particles were uniformly distributed in the b-Sn phase, which resulted in an increase in the tensile strength due to the second phase dispersion strengthening mechanism. However, in the doped Sn-9Zn/1.5Sb alloys, a-Zn phases were broken enormously, depleted and round shaped compared to the normal rod shaped a-Zn phase microstructure in plain Sn-9Zn solder. In comparison, the e-Sb 3 Zn 4 IMC particle in the doped Sn-9Zn/1.0Sb alloy were star shaped. The average tensile strength and microhardness of the Sb doped Sn-9Zn solder alloys were consistently higher than the plain un-doped Sn-9Zn solder. The tensile strength and the microhardness increased with increasing Sb nano-particle content, up to 1.0 wt% of Sb content, and then decreased beyond that threshold value. Consequently the percentage (%) elongation of the Sb nanoparticle doped Sn-9Zn solder decreased with increasing Sb nano-particle content, up to 1.0 wt% of Sb content, and then increased beyond that threshold value.

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

“…the elongation of the composite solder, as shown in Figure 13 [81]. The formation of ε-Sb3Zn4 not only reduced the amount of Zn atoms to form Zn-rich phase, but also acted as nucleation sites, making the distribution of Zn-rich phase more uniform.…”

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

“…Adding Sb to a SnBi solder improved the shear strength and creep resistance of solder joints [14][15][16]. Adding Sb nanoparticles to a Sn-9Zn solder increased its tensile strength, with the precipitated Sb3Zn4 acting as a second-phase strengthening agent [17]. Adding Sb to SnAg suppressed the coarsening of Ag 3 Sn and improved the reliability of solder joints [18][19][20].…”