Influence of slurry components on copper CMP performance in alkaline slurry

Polishing Approaches at Atomic and Close-to-Atomic Scale

“…It is noted that CMP has encountered difficulties such as: While softening the workpiece surface, the polishing slurry also has a corrosive effect on the polishing pads, resulting in more frequent replacement of polishing pads and higher costs. During the polishing of metals, the workpiece is easily scratched by the abrasive grains due to the low hardness, making it difficult to achieve sub-nanometer roughness [ 91 , 92 , 93 ]. Trial and error are inevitable to find an appropriate slurry recipe when CMP is applied to new metal material.…”

Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing

“…In order to ensure surface quality while increasing the polishing rate, many factors affecting surface quality have been studied for decades; among them, the CMP slurry is the most influencing parameter. Xu et al 15 investigated the effect of slurry components on the CMP performance of copper. By suitable configuration of the slurry components and optimal choice of the concentrations of the constituents, a surface roughness of less than 2.5 nm was acquired.…”

On the Evaluation of Thermodynamic Properties for Copper in Sodium Carbonate and Potassium Carbonate

“…were studied and their action as complexing agents is confirmed [13][14][15]. Benzotriazole (BTA), their derivative such as 1H-benzotriazole and 5-methyl benzotriazole [16][17], and polyvinyl pyrrolidone (PVP) [18] were some of the corrosion inhibitors reported for Cu CMP. This research work highlights the scope of sodium carbonate and potassium carbonate as oxidizers for Cu CMP and draws a comparative statement.…”