On the Evaluation of Thermodynamic Properties for Copper in Sodium Carbonate and Potassium Carbonate

Abstract

This study investigates sodium carbonate and potassium carbonate as oxidizers for copper (Cu) chemical mechanical planarization (CMP). The dissolution study was conducted to estimate etch rate (ER) in the entire odd pH range for both the suggested oxidizers. The etch rate decreases as the pH increases from acidic to alkaline region. The effect of change in temperature of the working solution on Cu dissolution is also investigated. Based on the experiment conducted and the values obtained, the enthalpy (ΔHact) and entropy (ΔSact) of both the system were calculated. The contact angle was measured to further examine the surficial synergy between the oxidizers and the exposed Cu surface.