Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

Skwarek, Agata; Illés, Béla; Górecki, Paweł; Pietruszka, Adrian; Tarasiuk, Jacek; Hurtony, Tamás

doi:10.1016/j.jmrt.2022.11.126

Cited by 18 publications

(11 citation statements)

References 42 publications

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“…As previously demonstrated, during the soldering process, nanoparticles are strategically positioned along the grain boundaries with the solder mass and with the IMC/Sn interphase (Skwarek et al, 2022), causing significant grain refinement of the Sn matrix. Schematic microstructure differences between the standard solder joint and the composite solder joint with nanoparticle inclusions are presented in Figure 1.…”

Section: Introductionmentioning

confidence: 69%

“…Such influence was already observed for several additions, including nanopowders and nanofibers, e.g. Al 2 O 3 , ZnO, SiC, TiO 2 and Co-GNSs (Skwarek et al, 2022;Rajendran et al, 2023;Pietruszka et al, 2023;Tamizi et al, 2024). It has been experimentally proven that the precise quantity of added nanoparticles can induce notable alterations in the microstructural composition of the solder joint.…”

Section: Introductionmentioning

confidence: 71%

Section: Introductionmentioning

confidence: 91%

“…Consequently, this results in a visible shift in the mechanical strength of the soldered joint (Tsao and Chang, 2010;Tang et al, 2014;Tamizi et al, 2024). Alterations in the microstructural composition substantially impact the thermal parameters of the solder joint, thereby causing consequential changes in the efficiency of the thermal heat transfer path (Skwarek et al, 2022).…”

Section: Introductionmentioning

confidence: 99%

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Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Pietruszka,

Górecki,

Skwarek

2024

SSMT

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Purpose This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2. Research limitations/implications Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly. Practical implications Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength. Social implications The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry. Originality/value The research shows the importance of the soldering technology used to assemble MOSFET devices.

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Section: Introductionmentioning

confidence: 69%

Section: Introductionmentioning

confidence: 71%

Section: Introductionmentioning

confidence: 91%

Section: Introductionmentioning

confidence: 99%

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Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Pietruszka,

Górecki,

Skwarek

2024

SSMT

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“…Various types of nanoparticles are used to modify lead-free solders, including metals particles (such as Al, Co, Ni, Mo, etc.) [13][14][15] and nonmetals (such as ZrO 2 , carbon nanotubes, graphene, SiC) [16][17][18][19]. Graphene is a two-dimensional carbon material with outstanding electrical and thermal conductivity and a high surface area.…”

Section: Introductionmentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

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In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

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Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Yordeiad,

Chantaramanee,

Sungkhaphaitoon

2024

J Mater Sci: Mater Electron

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Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

Cited by 18 publications

References 42 publications

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

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Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

Cited by 18 publications

References 42 publications

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Contact Info

Product

Resources

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Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components