J Mater Sci: Mater Electron
 2024
DOI: 10.1007/s10854-023-11911-8
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Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint

Thunsinee Yordeiad,
Suchart Chantaramanee,
Phairote Sungkhaphaitoon
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