2010
DOI: 10.1016/j.tsf.2010.05.002
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Influence of RF power on the electrical and mechanical properties of nano-structured carbon nitride thin films deposited by RF magnetron sputtering

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Cited by 11 publications
(7 citation statements)
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“…These includes electron cyclotron resonance microwave plasma chemical vapor deposition [7], rf magnetron sputtering, [8], graphite hollow cathode system [9], hollow cathode discharge [10], and radio frequency plasma enhanced chemical vapor deposition (rf-PECVD) [11]. Among these rf PECVD is favoured since this technique has the advantage of uniform large area deposition, easy handling, low pinhole density, good adhesion and good step coverage [11].…”
Section: Introductionmentioning
confidence: 99%
“…These includes electron cyclotron resonance microwave plasma chemical vapor deposition [7], rf magnetron sputtering, [8], graphite hollow cathode system [9], hollow cathode discharge [10], and radio frequency plasma enhanced chemical vapor deposition (rf-PECVD) [11]. Among these rf PECVD is favoured since this technique has the advantage of uniform large area deposition, easy handling, low pinhole density, good adhesion and good step coverage [11].…”
Section: Introductionmentioning
confidence: 99%
“…a-CN x thin films were deposited by rf-PECVD using a mixture of pure (99.999 %) methane, CH 4 and nitrogen, N 2 gas. The type of substrates used in this study was p-type (111) silicon chemically cleaned using acetone and deionized water in ultrasonic baths prior to deposition.…”
Section: Methodsmentioning
confidence: 99%
“…When the rf power exceeds 80W, CH 4 , main precursor gas is completed dissociation resulting in the saturated of available radicals and consequently the deposition rate [8]. Normally the radicals formed would react with unreacted molecules in secondary reactions in the plasma.…”
Section: Deposition Rate Of A-cn X Thin Filmsmentioning
confidence: 99%
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