Influence of residual layer on cross-sectional shape of thermal-reflowed photoresist structures

Mekaru, Harutaka

doi:10.1007/s00542-014-2389-z

Cited by 2 publications

(1 citation statement)

References 22 publications

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“…Vertical sidewalls are characteristic for binary patterning, but it is still a challenge to generate defined sidewall inclination or even cylindrical or spherical shapes with smooth surfaces. For this, isotropic etching processes or surface energy minimization of thermoplastic structures by thermal reflow [54][55][56][57][58][59], including strategies for selective reflow, have been developed. In Fig.…”

Section: Originationmentioning

confidence: 99%

Nanoimprint lithography: 2D or not 2D? A review

Schift

2015

Appl. Phys. A

107

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Nanoimprint lithography (NIL) is more than a planar high-end technology for the patterning of wafer-like substrates. It is essentially a 3D process, because it replicates various stamp topographies by 3D displacement of material and takes advantage of the bending of stamps while the mold cavities are filled. But at the same time, it keeps all assets of a 2D technique being able to pattern thin masking layers like in photon-and electron-based traditional lithography. This review reports about 20 years of development of replication techniques at Paul Scherrer Institut, with a focus on 3D aspects of molding, which enable NIL to stay 2D, but at the same time enable 3D applications which are ''more than Moore.'' As an example, the manufacturing of a demonstrator for backlighting applications based on thermally activated selective topography equilibration will be presented. This technique allows generating almost arbitrary sloped, convex and concave profiles in the same polymer film with dimensions in micro-and nanometer scale.

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