Influence of reducibility of reductant on nickel nanoparticles formation on polyimide

Huang, Shang-En; Dow, Wei‐Ping

doi:10.1109/impact.2010.5699514

Cited by 2 publications

(2 citation statements)

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“…The concentrations and temperatures applied in these two processes can be altered to produce the desired outcome. As such, the temperature and concentration of the different metal ions solutions were selected based on successful process conditions reported in the literature [5,12,16,[20][21][22]37]. To apply consistency between samples during the reduction process, the same reducing agent, NaBH4, was used using identical operational conditions for all metals.…”

Section: Reduction Of Metal Catalystsmentioning

confidence: 99%

“…Au and Ag both display a high catalytic activity and low susceptibility to oxidation [19]. These three metals are all costly due to their rare earth metal status, but cheaper alternatives are possible with Cu, Ni and Fe, that have been successfully demonstrated for electroless plating [12,20,21]. Co nanoparticles display a high functionality and are used in many advanced chemical and physical applications [22], and so, incorporating Co nanoparticles into PEI surfaces is of interest.…”

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confidence: 99%

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Direct metallisation of polyetherimide substrates by activation with different metals

Jones

Ryspayeva

Esfahani

et al. 2019

Surface and Coatings Technology

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This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) ×10 7 S/m and (3.6 ± 0.2) ×10 7 S/m, respectively) compared with bulk copper (5.96 ×10 7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 µm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

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