Influence of pulse power amplitude on plasma properties and film deposition in high power pulsed plasma enhanced chemical vapor deposition

Abstract

The discharge characteristics in high power pulsed plasma enhanced chemical vapor deposition is studied with the aim to characterize the impact of high power pulses (HiPP). Using a power scheme of combined HiPP and direct current (DC) to ignite the plasma discharge, and adjusting the HiPP/DC time-averaged power ratio while keeping the total power constant, the effect of the high power pulses was isolated from the total power. By monitoring the discharge current along with the optical emission from the plasma, it is found that the amount of available ions increased with increasing HiPP/DC ratio, which indicates a higher plasma density. Using carbon films deposited from acetylene in an argon plasma as model system, a strong increase in deposition rate with higher HiPP/DC is observed. The increased deposition rate is ascribed to a more efficient plasma chemistry generated by the denser plasma.

Time as the Fourth Dimension: Opening up New Possibilities in Chemical Vapor Deposition

“…This is because the process pressure, 65–175 Pa, has been too high for Langmuir probes and the collision-less plasma probe theory to work. In an attempt to indirectly measure the plasma density, the discharge current on the substrate holder was measured . The discharge current measured has been shown to directly correlate with the plasma density in HiPIMS .…”

“…In an attempt to indirectly measure the plasma density, the discharge current on the substrate holder was measured. 51 The discharge current measured has been shown to directly correlate with the plasma density in HiPIMS. 52 Here a higher discharge current was recorded when a higher amount of the total power was supplied as high power pulses, indicating a higher plasma density with more power supplied in high power pulses.…”

Simulator of Planar Electrodes Plasma Characteristics using Different Gases

“…To generate the plasma, there is a gas discharge that can be carried out by direct current, alternating current as radio-frequency or microwave. These plasma sources have many applications used in deposition of thin and thick films, materials treatment including surface modifications, light sources, semiconductor processing and treatment of waste [3][4][5][6][7][8][9][10]. The plasma can be classified into low and high temperature, where the low temperature, cold plasma, is divided into two types that are low and atmospheric pressures [11][12][13][14].…”