Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints

Tao, Yeqing; Ding, Dongyan; Li, Ting; Guo, Jason; Yu, Yunhong

doi:10.1007/s10854-016-4373-0

Cited by 7 publications

(4 citation statements)

References 11 publications

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“…Thus, the solder joints fabricated in the air atmosphere presented deficient On the contrary, the solder joints fabricated in the three protective systems showed plump fillets without insufficient solder defects. As shown in the previous research (Tao et al, 2016), wettability can be estimated through measurement of Sn climbing height at the components' terminals, and a higher Sn climbing height suggests better wettability. In a related study, Trip et al (2015) evaluated the solder joint solderability through wetting and filling of polymeric positive temperature coefficient (PPTC) devices reflowed in air and N 2 atmospheres.…”

Section: Effect Of Reflow Atmosphere On the Solderability Of 01005 Capacitor/sac305 Solder Jointsmentioning

confidence: 79%

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Tao

Ding

et al. 2017

SSMT

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Purpose This paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints. Design/methodology/approach The 01005 capacitors were mounted on OSP-coated pads, and the samples were fabricated in four different atmospheres, i.e. 200 ppm O2/N2, 1,000 ppm O2/N2, 3,000 ppm O2/N2 and air. After the reflow process, visual inspection and X-ray detection were carried out to examine the solder joint shapes and possible defects. Some of the samples fabricated in different conditions were cross-sectioned and the solder joint microstructures were analyzed. On the other hand, besides placing the components on their normal pad positions, a 50 per cent offset of the x-axis (long axis) or y-axis (short axis) was introduced into the chip mounter programs to evaluate the 01005 capacitor’s assembly sensitivity to placement accuracy. The process-induced defects were investigated. Findings Experimental results indicated that an N2-based protective atmosphere was necessary for 01005 type assembly, as it could obviously improve the 01005 solder joint quality, compared with the air condition. The protective atmosphere had little effect on the appearance, quality and microstructure of solder joints when the oxygen concentration was below 3,000 ppm. But a very low oxygen concentration could increase the risk of tombstoning defects for the assembly process. The N2-based protective atmosphere containing 1,000-2000 ppm O2 was acceptable and appropriate for the assembly of tiny components. Originality/value The results of this work provide a set of reflow process parameters and recommendations for 01005 size component assembly in manufacturing.

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Section: Effect Of Reflow Atmosphere On the Solderability Of 01005 Capacitor/sac305 Solder Jointsmentioning

confidence: 79%

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Tao

Ding

et al. 2017

SSMT

Self Cite

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“…In this past, a tin-lead solder was the most common solder, with excellent soldering properties and reliability [1][2][3][4][5]. However, lead is reported to be a toxic metal that will affect the human body and cause environmental pollution.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates

Laksono

Tsai

Chung

et al. 2022

Metals

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Cu-based alloys are one of the most promising substrates to enhance the performance of lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 wt.% Fe (C194), Cu-2.0 wt.% Be (Alloy 25), and Cu-3.3 wt.% Ti (C1990 HP) were investigated. The material underwent a liquid–solid interface reaction, and the reaction time was 0.5 to a few hours at the reaction temperatures of 240 °C, 255 °C, and 270 °C. The morphology, composition, growth rate, and growth mechanism of the intermetallic compounds (IMCs) formed at the interface were investigated in this study. The results showed that the reaction couples of SC/C194, SC/Alloy 25, and SC/C1990 HP formed IMCs, which were the [(Cu, Fe)6Sn5 and (Cu, Fe)3Sn], [(Cu, Be)3Sn and (Cu, Be)6Sn5], and [Cu6Sn5] phases, respectively. Finally, the IMC growth mechanism for the SC/C194, SC/Alloy 25, and SC/C1990 HP couples displayed reaction control, grain boundary diffusion control, and diffusion control, respectively.

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“…At present, the Sn-Ag-Cu alloy is the most extensively used lead-free material. Considering the influences of Ag on material properties and its cost, Sn3.0Ag0.5Cu (SAC305, Wt.%) was recommended as a common lead-free solder alloy (Tao et al , 2016).…”

Section: Introductionmentioning

confidence: 99%

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

Wan

et al. 2021

SSMT

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Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean-time-to-failure (MTTF) equation when joints are subjected to coupling stress. Design/methodology/approach The samples of the BGA package were subjected to a migration test at different currents and temperatures. Voltage variation was recorded for analysis. Scanning electron microscope and electron back-scattered diffraction were applied to achieve the micromorphological observations. Additionally, the experimental and simulation results were combined to fit the modified model parameters. Findings Voids appeared at the corner of the cathode. The resistance of the daisy chain increased. Two stages of resistance variation were confirmed. The crystal lattice orientation rotated and became consistent and ordered. Electrical and thermal stresses had an impact on the void formation. As the current density and temperature increased, the void increased. The lifetime of the solder joint decreased as the electrical and thermal stresses increased. A modified MTTF model was proposed and its parameters were confirmed by theoretical derivation and test data fitting. Originality/value This study focuses on the effects of coupling stress on the void formation of the SAC305 BGA solder joint. The microstructure and macroscopic performance were studied to identify the effects of different stresses with the use of a variety of analytical methods. The modified MTTF model was constructed for application to SAC305 BGA solder joints. It was found suitable for larger current densities and larger influences of Joule heating and for the welding ball structure with current crowding.

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Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints

Cited by 7 publications

References 11 publications

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

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