2009 IEEE International Ultrasonics Symposium 2009
DOI: 10.1109/ultsym.2009.5441557
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Influence of packaging atmospheres on the durability of high-temperature SAW sensors

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Cited by 22 publications
(21 citation statements)
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“…They reach a depth of more than 1 μm. This finding resembles the formation of voids near the LGS substrate surface of a SAW device in uncovered areas between the finger electrodes after a heat treatment at 650 C in light vacuum (0.4 mbar) observed by Bardong, et al [10]. …”
Section: Resultssupporting
confidence: 84%
See 1 more Smart Citation
“…They reach a depth of more than 1 μm. This finding resembles the formation of voids near the LGS substrate surface of a SAW device in uncovered areas between the finger electrodes after a heat treatment at 650 C in light vacuum (0.4 mbar) observed by Bardong, et al [10]. …”
Section: Resultssupporting
confidence: 84%
“…Bardong, et al investigated the influence of packaging atmospheres on the durability of high-temperature SAW sensors using LGS substrates among others [ 10 ]. They found no color change of the substrate during heating under air atmosphere, an effect which occurs during heating in vacuum, but in both cases there was a degradation of the crystal surface.…”
Section: Introductionmentioning
confidence: 99%
“…As described by Bardon et al annealing under vacuum conditions at 650 C leads to losses of the LGS crystal of O 2 and Ga 2 O 3 [10]. Since LGS has a higher Ga content, with the loss in Ga a higher oxygen diffusion can be expected as compared to annealing of CTGS.…”
Section: Discussionmentioning
confidence: 91%
“…The stabilization of Ga in the single crystal at high temperatures is critically dependent on the atmosphere in which the crystal is heated [1,10]. It has been reported that annealing under vacuum leads to an accelerated diffusion of Ga out from the substrate [1].…”
Section: Discussionmentioning
confidence: 99%
“…inert gas or vacuum). The crucial role of the atmosphere inside packages used for hightemperature SAW devices is described in detail in [13]. To minimize the mechanical stress for a sealed package, the same type of ceramic as used for the cavity package was selected as lid material (see figure 11).…”
Section: Fig 10 Schematics Of Stress-reduced Design For One-port Rementioning
confidence: 99%