Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin–lead based solders

Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

“…Thus, it is expected to improve the processing performance of Sn-Ag-Cu system solders by lowering melting temperature and decreasing surface tension of the solder when melting. Some studies had shown that the addition of element bismuth (Bi) to tin based solders can reduce melting temperature [7], decrease surface tension and thus improve processing performance [8] of the solder. However, the addition of bismuth may also result in brittleness of the solder and deteriorate mechanical property of the soldered joints.…”

Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

“…Thus, characterizations of creep and creep rupture of solders and their joints are important for reliability assessment and lifetime prediction of the packages. Moreover, due to environment and health concerns, conventional tin-lead eutectic solders are under constant regulatory and consumer pressure to reduce or eliminate toxic lead in most products [1][2][3][4][5][6][7][8][9]. This has pushed forward many recent research activities on lead-free solders.…”