Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu–xPOSS composite solders

Shen, Jun; Peng, Changfei; Yin, Heng Gang; Chen, Jie

doi:10.1007/s10854-012-0641-9

Cited by 12 publications

(5 citation statements)

References 13 publications

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“…The Sn3.8Ag0.7Cu solder containing 0.05 wt.% SiC nanoparticles can increase the microhardness by 44% compare with the plain solder [19]. The microhardness of Sn3.0Ag0.5Cu bearing POSS molecules was studied by Shen et al [68]. The microhardness increased with the increase amount of POSS molecules.…”

Section: Hardness Propertiesmentioning

confidence: 99%

“…Adding POSS molecules to the Sn3.0Ag0.5Cu composite solder can decrease the grains sizes and space lengths of Ag 3 Sn IMCs. As the POSS content increases further, the microstructure of SnAgCu solder has no significant change [68]. The graphene nanosheets (GNSs) as the additive into SnAgCu solder can restrict the grain growth and lead to finer IMC grains.…”

Section: Microstructuresmentioning

confidence: 99%

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Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Sun

Zhang

2015

Advances in Materials Science and Engineering

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SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

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Section: Hardness Propertiesmentioning

confidence: 99%

Section: Microstructuresmentioning

confidence: 99%

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Sun

Zhang

2015

Advances in Materials Science and Engineering

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“…可以看出强度和粒子直径成反比, 其他条件不变的条件下, 粒子直径越小, 则复合钎料的强度越高. [93] , 增加无铅钎料硬度, 但是当 Liu 等人 [97] 研究组采用石墨烯纳米片对 Sn3.0Ag0.5Cu 钎料进行改性, 钎料的熔化温度没有明显的变化, 润湿性显著提高, 线膨胀系数明显降低, 最大抗拉强度明显提高, 延伸率下降. 另外, 石墨烯纳米片可以提高 SnAgCu 钎料的抗腐蚀性, 最佳含量为 0.03%, 主要是因为石墨烯纳米片可以在钎料表面起到阻止氧化的物理钝化层作用, 当含量超过 0.03%, 复合钎料的抗腐蚀效果明显下降 [98] .…”

Section: Poss/cnt/gnssunclassified

Development of lead-free solders in China during the past decade

Zhang

Chen

et al. 2016

Sci. Sin.-Tech.

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For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders.

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“…After more than ten years of research, Sn-Ag-Cu (hereinafter referred to as SAC) solder is the most potential substitute for traditional Sn-Pb solder in the electronics industry with its good comprehensive performance. [1][2][3] However, compared with traditional SnPb solder, SAC still has certain deficiencies. Such as poor wettability, high melting point and other shortcomings.…”

Section: Introductionmentioning

confidence: 99%

Effect of ZnO micron-particles on properties and intermetallic compound layers of a Sn3.0Ag0.5Cu solder

Qu¹,

Cao²,

Cui³

et al. 2019

Jpn. J. Appl. Phys.

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The wettability, melting characteristics and thickness of intermetallic compound (IMC) layers of a Sn3.0Ag0.5Cu composite solder (SAC305) with four different contents (0.5 wt%, 1.0 wt%, 1.5 wt%, 2.0 wt%) of ZnO micron-particles were researched during aging. The results show that as the content of ZnO micron-particles increases, the wetting angle decreases and reaches a minimum at a content of about 1.5 wt%, while the expansion rate reaches a maximum. However, the effect on the melting point is not obvious; comparing the thicknesseses of the intermetallic compound(IMC) layer with different contents of ZnO micron-particles, it is found that the thickness of the IMC layer decreases with ZnO content increased to 1.5 wt%, which is mainly attributed to the fact that ZnO particles can reduce the diffusion coefficient. With comprehensive analysis of the three characteristics, it is revealed that the optimum addition amount of ZnO micron-particles is about 2.0 wt%.

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Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu–xPOSS composite solders

Cited by 12 publications

References 13 publications

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Development of lead-free solders in China during the past decade

Effect of ZnO micron-particles on properties and intermetallic compound layers of a Sn3.0Ag0.5Cu solder

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