Development of lead-free solders in China during the past decade

Abstract

For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders.

On Model of Plate Breakup

“…Two sets of principal shear fracture zones then appeared within the plate; the bisectors of their acute angles were parallel to the longitudinal force (Combined Diagram 1-C) (Zhang and Zhong, 1977).…”