Influence of Miniaturization on Mechanical Reliability of Lead‐Free Solder Interconnects

Khatibi, Golta; Ipser, Herbert; Lederer, M.; Weiß, B.

doi:10.1002/9781119966203.ch18

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Comparison Of Dcb and Arcan Specimens For Fracture Load Pred1

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2012

2015

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“…Refs. [57][58][59] showed that both the ultimate tensile strength and shear strength of lead-free solder joints increased as the joint volume decreased and/or the joint thickness to width ratio increased, both factors reflecting changes in the degree of solder constraint. This suggests that the application of solder J ci data to the prediction of fracture in actual solder joints requires that a similar degree of constraint be present in the specimen used in the fracture measurement and in the joint being analyzed.…”

Section: Comparison Of Dcb and Arcan Specimens For Fracture Load Predmentioning

confidence: 96%