2016
DOI: 10.1039/c5tc03791c
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Influence of magnetic alignment and layered structure of BN&Fe/EP on thermal conducting performance

Abstract: BN–Fe–BN structure orientation in a uniform magnetic field and the thermal conductivity of the samples reached 3.59 W m−1 K−1.

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Cited by 40 publications
(29 citation statements)
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“…Phonon propagations are significantly hindered and suppressed because of phonon scattering at the interfacial boundary between the filler and the matrix, thereby leading to low TC. 1,[43][44][45][46][47] For the foamed polymer composites, apparently, due to the biaxial flow of materials during the foaming process, the BNNSs probably either turn their face fixed face orientation, or are aligned along the flow direction of materials, i.e., along the cell…”
Section: Figure S1mentioning
confidence: 99%
See 1 more Smart Citation
“…Phonon propagations are significantly hindered and suppressed because of phonon scattering at the interfacial boundary between the filler and the matrix, thereby leading to low TC. 1,[43][44][45][46][47] For the foamed polymer composites, apparently, due to the biaxial flow of materials during the foaming process, the BNNSs probably either turn their face fixed face orientation, or are aligned along the flow direction of materials, i.e., along the cell…”
Section: Figure S1mentioning
confidence: 99%
“…8,12,[36][37][38][39][40][41][42] Other strategies include electric or magnetic field induced filler alignment, ultra-drawing, frozen-drying, and ultra-sonication, etc. [43][44][45][46][47][48][49] Up to now, extensive investigations on the preparation of heat conductive composites have been carried out on solid polymer matrix. 1,5,[18][19][20][21][22][23][24][25][26][27][28][29][30][31][32] The porous polymers with low densities and reduced weights, although they are promising for applications that are sensitive to weights such as aeronautics and astronautics, have received much less attention due to their extremely low TC as a result of introduced air (i.e.…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resin (EP) sealing materials are widely used in the field of electronic packaging due to their excellent electrical insulation and mechanical properties. However, the heat-conducting property of EP is very poor, and the intrinsic thermal conductivity is only 0.18 W/mK [1]. With the development of miniaturization of electronic equipment, the phenomenon of heat generation becomes more and more serious, which will greatly shorten the service life of the equipment [2].…”
Section: Introductionmentioning
confidence: 99%
“…Figure2shows the corresponding preparation schematic diagram. Steps (1),(2), and (3) are the preparation principles of GR-NH 2 , Fe 3 O 4 -epoxy, and magnetic GR, respectively.Step(1): the KH550 with NH 2 reacts with the hydroxyl groups of the GR, so that the GR is loaded with NH 2 . Step (2): the Fe 3 O 4 with hydroxyl groups reacts with KH560 with epoxy groups to make Fe 3 O 4 have epoxy groups.…”
mentioning
confidence: 99%
“…The use of magnetic fields during the process of the preparation of polymer composite materials can be also an effective way to orientat the filler [21][22][23]. This situation allows increasing the anisotropy of the composite and therefore preferential directions for the heat transport are created along the aligning direction of the filler aggregate.…”
Section: Introductionmentioning
confidence: 99%