2022
DOI: 10.1002/er.8229
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Influence of laser condition on the electrical and mechanical performance of bifacial half‐cutting PERC solar cell and module

Abstract: Summary In recent years, the laser half‐cutting technology for silicon solar cells has gotten much attention from researchers for increasing module power and would become particularly important in the photovoltaic modules domain. Herein, this paper would introduce a kind of new laser cutting process, a thermal laser separation (TLS) cutting technology. In the laser cutting processes, the influence on mechanical and electrical characteristics of bifacial p‐type passivated emitter and rear (PERC) solar cell and … Show more

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Cited by 10 publications
(5 citation statements)
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References 24 publications
(39 reference statements)
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“…It is characterized by a compact footprint (as shown in Figure 7A) and a very high degree of freedom in terms of wafer format (M2 to M12) and cutting layouts thanks to the use of a flexible chuck design and the possibility to add up to five process stations (see Figure 7B). This tool retains all the major benefits of TLS technology including high yield, reduced generation of microcracks, and hot spots, 51 and smooth cut edges which are key for subsequent edge re‐passivation. It can be inserted inline (with additional automation) or operated as standalone using high‐throughput automatic loading/unloading equipment also developed by 3D‐Micromac in HighLite (see Figure 7C).…”
Section: Resultsmentioning
confidence: 99%
“…It is characterized by a compact footprint (as shown in Figure 7A) and a very high degree of freedom in terms of wafer format (M2 to M12) and cutting layouts thanks to the use of a flexible chuck design and the possibility to add up to five process stations (see Figure 7B). This tool retains all the major benefits of TLS technology including high yield, reduced generation of microcracks, and hot spots, 51 and smooth cut edges which are key for subsequent edge re‐passivation. It can be inserted inline (with additional automation) or operated as standalone using high‐throughput automatic loading/unloading equipment also developed by 3D‐Micromac in HighLite (see Figure 7C).…”
Section: Resultsmentioning
confidence: 99%
“…From a reliability perspective, the smaller cells resulting from cutting are less susceptible to cracking than larger cells [38]. However, the cutting process introduces the potential for cell cracking due to defects along the cut edges [51], [52], [53].…”
Section: Cell Cuttingmentioning
confidence: 99%
“…Bosco et al [53] demonstrated that an optimized cutting process can essentially eliminate cracked cells due to static and dynamic mechanical loading, compared with nonoptimized processes that result in significant cell cracking. Researchers have also demonstrated that cutting cells via thermal laser separation produces less damage than cutting them via laser scribing and cleavage [51], [52]. [17], [18], [19], [20], [21], [22].…”
Section: Cell Cuttingmentioning
confidence: 99%
“…[23,24] In addition, the industry trend of using ever-larger wafer sizes, such as M10 and G12 formats (length of 182 and 210 mm, respectively), implies the necessity of cutting them into smaller cells before module integration. [25] During this process, the stress induced by the cleavage could generate defects and lead to delamination. The rationale for encapsulating metallized samples was that previously for c-Si cells, contraction of encapsulant around the busbars has been shown to result in a local high tensile stress being applied to the cells.…”
Section: Delamination In Encapsulated Samplesmentioning
confidence: 99%