“…Bonding by sintering of metallic nanoparticles (NP) is one of the low temperature joining technologies, which is a promising alternative for lead-free electronic packaging technology [2,3]. There have been many studies exploring metallic nanoparticle pastes for use in low temperature sintering, including Ag [4,5], Cu [6,7] and Ag oxide paste [8,9]. Among these nano pastes, Ag NP paste is receiving considerable attention due to the low sintering temperature, high melting point, good mechanical reliability and high thermal and electrical conductivity [10,11].…”