Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

“…After sintering, the joint can operate at 350°C with a corresponding homologous temperature of only 0.5. Nanoparticle sintering for high power and high temperature die attach applications have been previously reported using Ag NPs [6,8,[12][13][14][15] while sintering using Cu NPs have also been reported [16][17][18][19] although these typically require applied pressure, UV light or a reducing atmosphere for successful sintering. The present work reports on changes in shear strength and the corresponding evolution of voids and grain boundaries when a commercially available Ag NP paste is used to bond Si test die to a ceramic package with Ni/Au surface metallization, followed by storage at 300°C.…”

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

“…Cu nanoparticles have recently been studied as a bonding material instead of Ag nanoparticles, because Cu is inexpensive and less susceptible to electromigration [18]. However, robust bonding joints are hardly ever obtained without applying high pressures, because their oxidized surface layers prevent the Cu nanoparticles from sintering and reacting with the substrates [19,20].Recently, this technological challenge has been proven to be solved by forming the high-melting-point joints, which fully consist of intermetallic phases (IPs) through transient-liquid-phase (TLP) bonding or eutectic bonding processes [21][22][23]. However, a http://dx.…”

Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering

“…17 shows that the shear strengths of joints sintered with mixed Ag NP þ Ag NW with 10% Cu NP pastes increased with the sintering temperature and applied pressure. The shear strength of joints was significantly affected by the applied pressure through accelerating the densification and providing larger driving force during the sintering of nanomaterials than that the case of reaction without sintering pressure [6,27]. The structure became denser and the porosity of sintered mixed paste was decreased when the sintering temperature and pressure were increased.…”

“…Bonding by sintering of metallic nanoparticles (NP) is one of the low temperature joining technologies, which is a promising alternative for lead-free electronic packaging technology [2,3]. There have been many studies exploring metallic nanoparticle pastes for use in low temperature sintering, including Ag [4,5], Cu [6,7] and Ag oxide paste [8,9]. Among these nano pastes, Ag NP paste is receiving considerable attention due to the low sintering temperature, high melting point, good mechanical reliability and high thermal and electrical conductivity [10,11].…”