2009
DOI: 10.1002/ppap.200931804
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Influence of Ion Bombardment and Annealing on the Structural and Optical Properties of TiOx Thin Films Deposited in Inductively Coupled TTIP/O2 Plasma

Abstract: TiO2 films were deposited in a low‐pressure inductively coupled rf plasma in O2/titanium tetraisopropoxide (TTIP). First, depositions were realized at floating potential using nitrogen as bubbling gas. The structural and optical properties of the films were studied, before and after annealing at 450 °C under air. As expected, as‐deposited films are amorphous, with a columnar structure. A post‐annealing under flowing air allows obtaining partially crystallized films in anatase phase. Secondly, films were deposi… Show more

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Cited by 8 publications
(4 citation statements)
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“…For instance, reactive magnetron sputtering is a PVD plasma process which allows the deposition of columnar, amorphous or polycrystalline films (anatase and/or rutile phase) at relatively low substrate temperature (100 to 200 °C) [17][18]. At least, although much less studied, TiO 2 films can be grown by using chemical vapour deposition processes which are based on the dissociation of an inorganic (TiCl 4 ) or metallorganic (such as titanium tetraisopropoxide, TTIP, Ti-(OC 3 H 7 ) 4 ) precursor, by heating (conventional CVD) [19][20], atomic layer deposition (ALD) [21] or by plasma enhanced atomic layer deposition (PEALD) [22][23] and plasma enhanced chemical vapour deposition (PECVD) [24][25][26][27][28].…”
Section: Accepted Manuscriptmentioning
confidence: 99%
See 1 more Smart Citation
“…For instance, reactive magnetron sputtering is a PVD plasma process which allows the deposition of columnar, amorphous or polycrystalline films (anatase and/or rutile phase) at relatively low substrate temperature (100 to 200 °C) [17][18]. At least, although much less studied, TiO 2 films can be grown by using chemical vapour deposition processes which are based on the dissociation of an inorganic (TiCl 4 ) or metallorganic (such as titanium tetraisopropoxide, TTIP, Ti-(OC 3 H 7 ) 4 ) precursor, by heating (conventional CVD) [19][20], atomic layer deposition (ALD) [21] or by plasma enhanced atomic layer deposition (PEALD) [22][23] and plasma enhanced chemical vapour deposition (PECVD) [24][25][26][27][28].…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…In addition, the low pressure radiofrequency inductively coupled plasma such as the one used in this study, offers the possibility to control independently the ion density (fixed by the power coupled to the plasma source) and the ion energy (by biasing the substrate). Since the ion energy actively influences the film growth through surface activation and densification, its control is crucial for tailoring the film structure [28,32].…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…), and to be compatible with silicon based semiconductor technologies. In addition, for high density inductively coupled plasma (ICP) reactors, such as helicon ones, one of the most important advantages is their ability to control the ion energy, independently on the plasma density [10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…We investigated the influence of the ICP source power, the table power, and the chamber pressure effects on the TiO 2 thin film properties. The radiofrequency (RF) power of the ICP source varied from 800 W to 1500 W, which was substantially higher than in previous studies [ 14 , 21 , 22 , 23 ]. Note that it is actually not straightforward to make a comparison since the source diameter and the exposed area of the lower electrode are probably not the same.…”
Section: Methodsmentioning
confidence: 82%