2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018)
DOI: 10.1109/pesc.2000.880545
|View full text |Cite
|
Sign up to set email alerts
|

Influence of gate internal impedance on losses in a power MOS transistor switching at a high frequency in the ZVS mode

Abstract: In order to use a power MOS transistor in the ZVS mode at high switching frequencies, the output capacitance has to be maximal and the input capacitance minimal. These characteristics available in the datasheets have to be completed if necessary tu choose the ideal transistor for application with minimal losses, and additional characterisations have to be realised in order to specify or complete the datasheets. In particular, it is necessary to be sure that all the cells of the MOS transistor can be opened in … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 4 publications
0
1
0
Order By: Relevance
“…Another reason is the buried polysilicon forming the plate electrode which, unlike the gate polysilicon, cannot be salicided. As a result, propagation delay across the layout is susceptible to occur due to an internal R sh at the plate [15, 16].…”
Section: Low‐voltage Silicon Power Mosfetsmentioning
confidence: 99%
“…Another reason is the buried polysilicon forming the plate electrode which, unlike the gate polysilicon, cannot be salicided. As a result, propagation delay across the layout is susceptible to occur due to an internal R sh at the plate [15, 16].…”
Section: Low‐voltage Silicon Power Mosfetsmentioning
confidence: 99%