Influence of Electric Current at Solidification of Solder

Skacel, Josef; Otahal, Alexandr; Szendiuch, Ivan

doi:10.1109/isse.2019.8810308

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Macrovoids1

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Cited by 3 publications

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“…), components (geometry, shape, terminal oxidation, etc.) and the process (thickness, the shape and the parameters of the solder paste's printed layer, temperature profile) [22][23][24][25][26]. An example of macrovoids in the solder joints of a soldered BGA package on the PCB is given in Figure 18.…”

Section: Macrovoidsmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

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The formation of defects and imperfections in the soldering process can have many causes, which primarily include a poorly setup technological process, inappropriate or inappropriately used materials and their combinations, the effect of the surroundings and design errors. This chapter lists some examples of errors that can occur in soldering, while review is devoted to selected defects: non-wettability of the solder pads, dewetting, wrong solder mask design, warpage, head-in-pillow, cracks in the joints, pad cratering, black pad, solder beading, tombstoning, dendrites, voids, flux spattering from the solder paste, popcorning and whiskers.

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Section: Macrovoidsmentioning

confidence: 99%