2021
DOI: 10.1007/s10008-021-04942-w
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Influence of Ce0.8R0.2O2–a (R = Y, Sm, Tb) submicron barrier layers at the La2NiO4+δ/YSZ boundary on the electrochemical performance of a cathode

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Cited by 3 publications
(2 citation statements)
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“…Therefore, the development of electrodes that are highly active in the IT range and compatible with CeO 2 and BaCeO 3 electrolytes is of great importance [ 30 , 31 , 32 ]. The rate of oxygen reduction reaction (ORR) at the cathode can be increased using cathode sublayers possessing higher ionic conductivity compared to the parent electrolyte, for example, doped Bi 2 O 3 electrolytes [ 33 , 34 ] or those with mixed oxygen ion and p -type electron conductivity [ 35 , 36 , 37 , 38 ]. For example, mixed valence Pr 3+/4+ used as a co-dopant was found to induce partial electronic conductivity in Gd-doped CeO 2 in an air atmosphere, increasing the grain boundary conductivity by about two orders compared to the base solid solution [ 39 , 40 ].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the development of electrodes that are highly active in the IT range and compatible with CeO 2 and BaCeO 3 electrolytes is of great importance [ 30 , 31 , 32 ]. The rate of oxygen reduction reaction (ORR) at the cathode can be increased using cathode sublayers possessing higher ionic conductivity compared to the parent electrolyte, for example, doped Bi 2 O 3 electrolytes [ 33 , 34 ] or those with mixed oxygen ion and p -type electron conductivity [ 35 , 36 , 37 , 38 ]. For example, mixed valence Pr 3+/4+ used as a co-dopant was found to induce partial electronic conductivity in Gd-doped CeO 2 in an air atmosphere, increasing the grain boundary conductivity by about two orders compared to the base solid solution [ 39 , 40 ].…”
Section: Introductionmentioning
confidence: 99%
“…Various methods are used for the deposition of barrier layers in SOFC technology [21,22]: ceramic methods, such as screen-printing [23] and tape calendering [24,25]; vacuum deposition technologies, e.g., magnetron sputtering [26,27], pulsed laser deposition [10,28], and physical vapor deposition (PVD) [29]; aerosol-spraying methods under atmospheric [30] and reduced pressures [31]; and colloidal and solution technologieselectrophoretic deposition [32,33], dip-coating and sol-gel [34,35], suspension centrifugation [36] etc. One of the flexible, easy-to-implement, and cheap technologies is electrophoretic deposition (EPD), which does not require high-tech equipment and allows the deposition of coatings at room temperature in ambient air with a sufficiently high deposition rate of ~1-10 µm per 1 min [37].…”
Section: Introductionmentioning
confidence: 99%