Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating

Tang, Liping; Han, Silin; Chen, Peixin; Hang, Tao; Ling, Huiqin; Wu, Yunwen; Li, Ming

doi:10.1016/j.matchemphys.2022.126338

Cited by 4 publications

(3 citation statements)

References 19 publications

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“…Generally, i 0 is a variable defined in the Butler–Volmer equation and a measure of the electrochemical reversibility of the electrode reaction. [ 47–49 ] For the Zn 2+ plating process, the higher the i 0 value, the faster the rate of electrochemical reactions, which can be obtained from the Zn plating voltage profiles at various current densities with the equation as [ 50 ]

\begin{equation}i\ = {i}_0\ \times \frac{F}{{RT}} \times \frac{{{\eta }_{{\mathrm{tot}}}}}{2}\end{equation}

where η tot , i 0 , F , R , and T represent the deposition over‐potential, exchange current density, Faraday constant, molar gas content, and absolute temperature, separately. After fitting, the Zn@UO‐24 symmetric cell displays a higher i 0 (4.23 mA cm −2 ) compared with the pristine Zn symmetric cell (1.69 mA cm −2 ), further confirming the speedy reaction kinetics (Figure 4e).…”

Section: Resultsmentioning

confidence: 99%

“…Generally, i 0 is a variable defined in the Butler-Volmer equation and a measure of the electrochemical reversibility of the electrode reaction. [47][48][49] For the Zn 2+ plating process, the higher the i 0 value, the faster the rate of electrochemical reactions, which can be obtained from the Zn plating voltage profiles at various current densities with the equation as [50] i…”

Section: Experimental and Theoretical Simulation Analysis Of The Inte...mentioning

confidence: 99%

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Synergistic Modulation of Mass Transfer and Parasitic Reactions of Zn Metal Anode via Bioinspired Artificial Protection Layer

Gou,

Chen,

Luo

et al. 2023

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Rechargeable aqueous zinc–ion batteries are regarded as promising energy storage devices due to their attractive economic benefits and extraordinary electrochemical performance. However, the sluggish Zn2+ mass transfer behavior and water‐induced parasitic reactions that occurred on the anode–electrode interface inevitably restrain their applications. Herein, inspired by the selective permeability and superior stability of plasma membrane, a thin UiO‐66 metal‐organic framework layer with smart aperture size is ex‐situ decorated onto the Zn anode. Experimental characterizations in conjunction with theoretical calculations demonstrate that this bio‐inspired layer promotes the de‐solvation process of hydrated Zn2+ and reduces the effective contact between the anode and H2O molecules, thereby boosting Zn2+ deposition kinetics and restraining interfacial parasitic reactions. Hence, the Zn||Zn cells could sustain a long lifespan of 1680 h and the Zn||Cu cells yielded a stable coulombic efficiency of over 99.3% throughout 600 cycles under the assistance of the bio‐inspired layer. Moreover, pairing with δ‐MnO2 cathode, the full cells also demonstrate prominent cycling stability and rate performance. From the bio‐inspired design philosophy, this work provides a novel insight into the development of aqueous batteries.

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\begin{equation}i\ = {i}_0\ \times \frac{F}{{RT}} \times \frac{{{\eta }_{{\mathrm{tot}}}}}{2}\end{equation}

Section: Resultsmentioning

confidence: 99%

Section: Experimental and Theoretical Simulation Analysis Of The Inte...mentioning

confidence: 99%

Synergistic Modulation of Mass Transfer and Parasitic Reactions of Zn Metal Anode via Bioinspired Artificial Protection Layer

Gou,

Chen,

Luo

et al. 2023

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“…In our previous work, 26 we proposed a new parameter "artificial exchange current density" (j A ) derived from the Butler-Volmer equation, describing the cathode and anode reactions under an external electrical field. j A is similar to the exchange current density (j 0 ) while the latter describes the deposition and dissolution reactions under the equilibrium electrochemistry system.…”

mentioning

confidence: 99%

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Tang¹,

Yan²,

Han³

et al. 2022

J. Electrochem. Soc.

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Copper (Cu) coatings with a high surface area have attracted significant attention for functional devices due to their high thermal and electrical properties. Pulse-reverse current (PRC) electrodeposition has been introduced to fabricate Cu coatings for a long history, but little attention has been paid to the synergistic effects of anodic and cathodic steps instead of the individual anodic step. The new parameter “artificial exchange current density” (jA) has been demonstrated to quantify the effects of anodic and cathodic currents on the morphology in our previous work. Herein, a key metricthe relative current amplitudethat is positively correlated with jA, is used to further clarify the role of jA in the electrodeposition process. We fabricate Cu coatings with well-dispersed pyramid-like structures and find the relative current amplitude dominates the formation of a larger raised structure at the initial nucleation stage. Moreover, the anodic current can dissolve high-energy planes and achieve a high (111) texture. Afterward, screw dislocation drives the spiral growth of grains, resulting in pyramid-like structures. This study not only enriches our understanding of the artificial exchange current density in PRC electrodeposition but also guides us to achieve Cu coatings with high surface area.

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Influence of SiO2 Nanoparticles Extracted from Biomass on the Properties of Electrodeposited Ni Matrix Composite Films on Si(100) Substrate

Mladenović,

Nikolić,

Jovanov

et al. 2024

Materials

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Lab-made biosilica (SiO2) nanoparticles were obtained from waste biomass (rice husks) and used as eco-friendly fillers in the production of nickel matrix composite films via the co-electrodeposition technique. The produced biosilica nanoparticles were characterized using XRD, FTIR, and FE-SEM/EDS. Amorphous nano-sized biosilica particles with a high SiO2 content were obtained. Various current regimes of electrodeposition, such as direct current (DC), pulsating current (PC), and reversing current (RC) regimes, were applied for the fabrication of Ni and Ni/SiO2 films from a sulfamate electrolyte. Ni films electrodeposited with or without 1.0 wt.% biosilica nanoparticles in the electrolyte were characterized using FE-SEM/EDS (morphology/elemental analyses, roundness), AFM (roughness), Vickers microindentation (microhardness), and sheet resistance. Due to the incorporation of SiO2 nanoparticles, the Ni/SiO2 films were coarser than those obtained from the pure sulfamate electrolyte. The addition of SiO2 to the sulfamate electrolyte also caused an increase in the roughness and electrical conductivity of the Ni films. The surface roughness values of the Ni/SiO2 films were approximately 44.0%, 48.8%, and 68.3% larger than those obtained for the pure Ni films produced using the DC, PC, and RC regimes, respectively. The microhardness of the Ni and Ni/SiO2 films was assessed using the Chen-Gao (C-G) composite hardness model, and it was shown that the obtained Ni/SiO2 films had a higher hardness than the pure Ni films. Depending on the applied electrodeposition regime, the hardness of the Ni films increased from 29.1% for the Ni/SiO2 films obtained using the PC regime to 95.5% for those obtained using the RC regime, reaching the maximal value of 6.880 GPa for the Ni/SiO2 films produced using the RC regime.

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Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating

Cited by 4 publications

References 19 publications

Synergistic Modulation of Mass Transfer and Parasitic Reactions of Zn Metal Anode via Bioinspired Artificial Protection Layer

Synergistic Modulation of Mass Transfer and Parasitic Reactions of Zn Metal Anode via Bioinspired Artificial Protection Layer

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Influence of SiO2 Nanoparticles Extracted from Biomass on the Properties of Electrodeposited Ni Matrix Composite Films on Si(100) Substrate

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