Two differently structured WSiz phases were formed by direct W ion implantation, for the first time, into silicon wafers using a metal vapour vacuum arc ion source. Implantation of W ions was conducted with an extract voltage of 40 kV, various beam densities from 50 to I I5 p A cm-' and a fixed dose of 5 x IOt7 cm-'. It was found that the formation of WSh with either a hexagonal or a tetragonal stmctm depended on the ion current density. The temperature rise caused by beam heating and the beam-striking time related to the dose were calculated, and they were responsible for the fomtion and evolution related to the differently StNCtUed WSh phases.