Influence of Aniline Addition on the Cure, Mechanical Properties and Water Absorption Characteristics of Amine Cured Epoxy Resins

Pethrick, Richard A.; Dejean, Renaud; Marie, Frank; Hollins, Elisabeth A.; McEwan, Lain; McNairney, Sinead

doi:10.1080/00914039808034838

Cited by 4 publications

(4 citation statements)

References 18 publications

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“…The moisture is not lost but is moving into the matrix and becoming molecularly dispersed. This effect has been observed previously with other epoxy systems . The rise after 332 h exposure followed by a decrease again (both above the initial starting value) reflecting the moisture filling the voids which can collapse as the water is re‐dispersed.…”

Section: Resultssupporting

confidence: 82%

“…The relaxation located ∼100 KHz is ascribed to dipole reorientation of OH groups and water molecules attached to the hydroxyl groups of the epoxy matrix. Plots of the permittivity and loss measured at 1 kHz reflect the changes in the total dipole relaxation for both “bound” and “free” in the resin, Figure (a,b).…”

Section: Resultsmentioning

confidence: 99%

“…System A Aged at 50 °C and 70°. Previous studies have shown that clustered water in nano‐voids exhibit a relaxation centred at ∼1 × 10 10 Hz and, therefore, a plot of the variation of the permittivity ɛ ′(ω) at 1.28 × 10 10 Hz is a measure of the dipolar relaxation associated with “free” water . Three blocks of each type of cure were measured and the average of these measurements is plotted in Figure .…”

Section: Resultsmentioning

confidence: 99%

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A dielectric study of water uptake in epoxy resin systems

Garden¹,

Pethrick²

2017

J of Applied Polymer Sci

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The influence of epoxy resin formulation on the nature and extent of moisture is studied using dielectric and gravimetric analysis for samples cured at 40, 50, 60, and 70 8C and aged at 50 8C and 70 8C. The equilibrium moisture uptake depends on the difference between the glass transition and aging temperature. Dielectric relaxation data measured from 1 to 3 3 10 10 Hz indicates the presence of water in at least two different environments. The high frequency relaxation ca. 1 3 10 10 Hz is associated with water clustered in nano-voids, whereas the relaxation at 10 5 Hz arises from a combination of OH pendant group reorientation motion coupled with that of molecularly dispersed water molecules. A correlation exist between the dielectric permittivity and the amount of moisture absorbed. Water initially resident in voids is re-dispersed with aging into the resin matrix aiding plasticization and allowing densification of the matrix. The extent to which changes occur depends on the chemical functions forming the matrix and densification leads to a drop in the amount of water absorbed. In the complex resin systems, water interacts with both OH groups and polyether of the amine curing agent which is not possible with the aliphatic diamine in the simple system.] V C 2017 Wiley Periodicals, Inc. J. Appl. Polym.Sci. 2017, 134, 44717.

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Section: Resultssupporting

confidence: 82%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

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A dielectric study of water uptake in epoxy resin systems

Garden¹,

Pethrick²

2017

J of Applied Polymer Sci

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“…The peak temperature of tan δ was taken to be T g . Figure 8(b) and Table I indicate that T g of the cured polymer from the DGEBF/BPF system was 238.5°C and therefore higher than the T g values of E‐44/BPF, DGEBA/DDM,15, 31 and DGEBA/DDS32 (183.0, 167.0–194.8, and 200.4°C, respectively) and close to those of the cured DGEBF/DDM and DGEBF/DDS polymers (248.0 and 252.5°C, respectively). T g is affected by both the crosslink density and the backbone rigidity of the epoxy monomer.…”

Section: Resultsmentioning

confidence: 90%

Preparation and properties of one epoxy system bearing fluorene moieties

Liu

Qiu

Wang

et al. 2009

J of Applied Polymer Sci

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Diglycidyl ether of bisphenol fluorene (DGEBF) and 9,9-bis(4-aminophenyl) fluorene (BPF) were synthesized to introduce more aromatic structures into an epoxy system, and their chemical structures were characterized with Fourier transform infrared spectroscopy, NMR, and mass spectrometric analysis. The dynamic curing behavior of the DGEBF/BPF system was investigated with differential scanning calorimetry. DGEBF was cured with BPF, diaminodiphenylsulfone (DDS), and diaminodiphenylmethane (DDM), and E-44 (bisphenol A epoxide) was also cured with BPF for comparison. The thermal properties of the obtained polymers were evaluated with dynamic mechanical thermal analysis and thermogravimetric analysis. The cured DGEBF/BPF system showed a remarkably higher glass-transition temperature, better thermal stability and lower moisture absorption in comparison with the general bisphenol A epoxy resin/BPF system but approximated the heat resistance of the DGEBF/DDS and DGEBF/DDM systems. Such properties make this epoxy system very promising for heat-resistant applications.

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Tertiary‐amine‐free, non‐planar, sulfone‐containing, tetrafunctional epoxy and its application as a high temperature matrix

Zhang

Miao

et al. 2020

Polymer International

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Non‐amine‐derived tetrafunctional epoxies have several advantages over the amine‐derived N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenyl methane (TGDDM) in high temperature applications. Although two non‐amine‐derived tetrafunctional epoxies were developed in our laboratory, further improvements in toughness using less loading amount is still desirable. Thus, a tertiary‐amine‐free, non‐planar and triphenylmethane‐containing tetrafunctional epoxy (STFE) with a sulfone spacer was synthesized. When it was mixed with diglycidyl ether of bisphenol A (DGEBA) and cured with 4,4′‐diaminodiphenylsulfone (DDS), both thermal and mechanical performances outperformed TGDDM. Moreover, STFE modified system shows the highest toughness (35.7 kJ m–2) among three amine‐free and triphenylmethane‐containing epoxies at merely 5 wt% loading. Molecular simulation and thermomechanical analysis results suggest that the improved mechanical properties could be related to the geometry of the molecule and larger free volume. Despite a marginal drop in Tg, the thermal degradation temperature is better than that of TGDDM/DDS. In addition, the moisture resistance of STFE/DGEBA/DDS is much better than that of TGDDM/DDS. Thus, STFE modified DGEBA could be a potential replacement for TGDDM in some high temperature applications. © 2020 Society of Chemical Industry

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Influence of Aniline Addition on the Cure, Mechanical Properties and Water Absorption Characteristics of Amine Cured Epoxy Resins

Cited by 4 publications

References 18 publications

A dielectric study of water uptake in epoxy resin systems

A dielectric study of water uptake in epoxy resin systems

Preparation and properties of one epoxy system bearing fluorene moieties

Tertiary‐amine‐free, non‐planar, sulfone‐containing, tetrafunctional epoxy and its application as a high temperature matrix

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