Preparation and properties of one epoxy system bearing fluorene moieties

Liu, Wenbin; Qiu, Qihao; Wang, Jun; Huo, Zichun; Sun, He; Zhao, Xueyuan

doi:10.1002/app.30141

Cited by 29 publications

(14 citation statements)

References 34 publications

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“… Literature values of rubbery modulus data collected using SC . An assumed misplaced decimal point results in shifting the circled points the data to the left.…”

Section: Discussionmentioning

confidence: 99%

DMA testing of epoxy resins: The importance of dimensions

McAninch

Palmese

Lenhart

et al. 2015

Polymer Engineering & Sci

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Dynamic mechanical analysis is commonly used to characterize thermoset polymers at temperatures ranging from well below to well above their glass transition temperatures. Many sample fixtures are available; however, the best clamp and best sample dimensions for a given material are not often readily apparent. Five different epoxy amine networks with glass transitions spanning over 1008C were characterized on three-point bending, dual cantilever, and single cantilever clamps with both constant thickness and constant span-to-thickness. Glassy modulus values were accurately measured on all clamps provided span-to-thickness ratios >10 were maintained. Thermal expansion and decreasing sample stiffness with increasing temperature greatly affect measurements in the rubbery region resulting in single cantilever clamps being best suited to measure rubbery data.

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“… Literature values of rubbery modulus data collected using SC . An assumed misplaced decimal point results in shifting the circled points the data to the left.…”

Section: Discussionmentioning

confidence: 99%

DMA testing of epoxy resins: The importance of dimensions

McAninch

Palmese

Lenhart

et al. 2015

Polymer Engineering & Sci

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“…The M1 /DGEBA/DDS blends had better thermal stability than M1 /DGEBA/DDM blends because the sulfuryl group in DDS had better thermal resistance properties than the methylene in DDM. That thermosets using DDS as curing agents had better thermal stability than thermosets based on the same monomer using DDM as curing agents could be found in some investigation by other authors 38. Anyway, thermosets based on M1 are one kind of LCETs with excellent thermal stabilities.…”

Section: Resultsmentioning

confidence: 72%

Mechanical Properties and Morphology Studies of Thermosets from a Liquid‐Crystalline Epoxy Resin with Biphenol and Aromatic Ester Groups

Liu

Cai

Wang

et al. 2010

Macro Materials & Eng

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Liquid‐crystalline epoxy thermosets were prepared by adding M1 into DGEBA/DDM blends. M2 was added to DGEBA/DDM to produce thermosets for comparison. The influences of the concentration and chemical structure on the mechanical and thermal properties were investigated systematically. The M1/DGEBA blends possessed increased rubbery plateau modulus, higher glass transition temperatures, and lower tan δ. The use of small amounts of M1 may improve the mechanical properties greatly. Izod notched impact strength could be enhanced by 55% by addition of 2% M1 compared to unmodified DGEBA blends. Extremely rough and highly deformed fracture surface could be obtained in the M1/DGEBA blends. M1/DGEBA blends also exhibited excellent thermal properties. magnified image

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“…This indicated that DHPOP had a higher reactivity than DGEBA when cured with DDM. On one hand, the flexible ether linkage embedded in DHPOP maybe weaken steric hindrance in the curing process . On the other hand, this phenomenon may be also attributed to the electronic effect of oxygen atom, which increase the reactivity of epoxy groups and decrease the activation energy of curing reaction.…”

Section: Resultsmentioning

confidence: 99%

Preparation of 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether with improved toughness behavior

Liu

Sun

Zhang

et al. 2018

J of Applied Polymer Sci

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A high‐performance difunctional epoxy resin, 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether (DHPOP), was synthesized by a two‐step method. The curing behavior of DHPOP was investigated by nonisothermal differential scanning calorimetry method and the curing kinetics results revealed that the introduction of ether linkage could improve the activity of epoxy groups, leading to a lower curing temperature and apparent activation energy compared with that of the commercial bisphenol‐A diglycidyl ether (DGEBA). A series of copolymers were then prepared by varying the mass ratio of DHPOP and DGEBA, which were cured with 4,4′‐diaminodiphenyl methane. The effect of DHPOP contents on thermal and mechanical properties and fracture morphology was studied. As expected, with the increase of DHPOP in the network, the impact strength and char yield were significantly enhanced, while the glass transition temperature (Tg) remained unchanged because of the increase of crosslink density. The excellent toughness endows the DHPOP with the promising potential for the application as high‐performance resin matrix. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46458.

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Preparation and properties of one epoxy system bearing fluorene moieties

Cited by 29 publications

References 34 publications

DMA testing of epoxy resins: The importance of dimensions

DMA testing of epoxy resins: The importance of dimensions

Mechanical Properties and Morphology Studies of Thermosets from a Liquid‐Crystalline Epoxy Resin with Biphenol and Aromatic Ester Groups

Preparation of 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether with improved toughness behavior

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