Influence of Al2O3 additions on the crystallization mechanism and properties of diopside/anorthite hybrid glass-ceramics for LED packaging materials

Kang, Min‐A; Kang, Sang Koo

doi:10.1016/j.jcrysgro.2011.01.081

Cited by 26 publications

(12 citation statements)

References 11 publications

(9 reference statements)

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“…The crystallization kinetic characteristics of LASa and LASb glasses are calculated by, Kissinger [24][25][26][27], Marotta [12] and Augis-Bennett [27,28], using the equations as followed,…”

Section: Crystallization Kineticsmentioning

confidence: 99%

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

Mishra

Goswami

Dixit

et al. 2016

Journal of Non-Crystalline Solids

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Section: Crystallization Kineticsmentioning

confidence: 99%

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

Mishra

Goswami

Dixit

et al. 2016

Journal of Non-Crystalline Solids

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“…Examples are radio frequency-system in-apackage (RF-SiP) module, LED packages, high temperature sensors, microelectromechanical system (MEMS) package, micro-heaters, microfluidics etc. [28][29][30][31][32][33][34][35][36][37][38].…”

Section: Ltcc Ceramics With High Thermal Conductivitymentioning

confidence: 99%

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

Kim¹

2018

Heat Transfer - Models, Methods and Applications

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Recently, ceramic substrates have been of great interest for use in light emitting diode (LED) packaging materials because of their excellent heat transfer capability. The thermal conductivities of ceramic-based substrates are usually one or two orders of magnitude higher than those of conventional epoxy-based substrates. The demand for ceramic substrates with high mechanical strength and thermal conductivity is also growing due to their use in thin and high-power device packaging substrates. Examples are direct bonded copper or aluminum or direct plated copper substrates for insulated gate bipolar transistors; thin and robust ceramic packages for image sensor modules that are used in mobile smart phones; ceramic packages for miniaturized chip-type supercapacitors; and high-power LED packages. This chapter will cover the development and application of ceramics and ceramic composites with high thermal conductivity for the thermal management of integrated electronic packaging substrates such as high-power LED packaging, power device packaging, etc.

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“…34 CaO-BaO-Al 2 O 3 -B 2 O 3 -SiO 2 / AlN and Li 2 O-SiO 2 -ZrO 2 /Al 2 O 3 glass/ceramic composites exhibit high thermal conductivity, but their mechanical strength is low. 18,[35][36][37][38] Therefore, it is necessary to develop new types of glass/ceramic composites that have both high mechanical strength and good thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Lee

Cho

Lee³

et al. 2018

J Am Ceram Soc

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A CaO‐B2O3‐SiO2 (CBS) glass/40 wt% Al2O3 composite sintered at 900°C exhibited a dense microstructure with a low porosity of 0.21%. This composite contained Al2O3 and anorthite phases, but pure glass sintered at 900°C has small quantities of wollastonite and diopside phases. This composite was measured to have a high bending strength of 323 MPa and thermal conductivity of 3.75 W/(mK). The thermal conductivity increased when the composite was annealed at 850°C after sintering at 900°C, because of the increase in the amount of the anorthite phase. 0.25 wt% graphene oxide and 0.75 wt% multi‐wall carbon nanotubes were added to the CBS/40 wt% Al2O3 composite to further enhance the thermal conductivity and bending strength. The specimen sintered at 900°C and subsequently annealed at 850°C exhibited a large bending strength of 420 MPa and thermal conductivity of 5.51 W/(mK), indicating that it would be a highly effective substrate for a chip‐type supercapacitor.

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Influence of Al2O3 additions on the crystallization mechanism and properties of diopside/anorthite hybrid glass-ceramics for LED packaging materials

Cited by 26 publications

References 11 publications

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

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Influence of Al2O3 additions on the crystallization mechanism and properties of diopside/anorthite hybrid glass-ceramics for LED packaging materials

Cited by 26 publications

References 11 publications

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

Study on thermophysical properties and phase evolution in Nd doped Li2O-Al2O3-SiO2 glass nucleated by multiple nucleating agents

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

Carbon nanotube/graphene oxide‐added CaO‐B2O3‐SiO2 glass/Al2O3 composite as substrate for chip‐type supercapacitor

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Product

Resources

About

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor