Infiltrated Cu8Al–Ti alumina composites

Abstract

The e↵ect of titanium additions on the interface and mechanical properties of infiltrated Cu8wt%Al-Al 2 O 3 composites containing 57±2 vol% ceramic are investigated, exploring two di↵erent Al 2 O 3 particle types and

Strain-induced martensitic transformation of particles in a copper-based composite and its effect on mechanical properties

“…Compared with the copper-ceramic composites shown in Ref. [10] or other references, the elongations (5% and 6%) of cold rolled composites are both much higher than those (only around 1.0%) of them. Accordingly, it is a really good way to solve the poor deformability of copper-based composite by applying the martensitic transformation of Fe\ \C particles, valuable to further study this copper-based composite with high strength and good deformability.…”

“…Accordingly, the used cooling rate (− 0.515 × 10 3 K/s~− 0.773 × 10 4 K/s) should be enough to ensure the Fe\ \C particles uniformly distributing in the matrix. Compared with the copper-ceramic composites with a poor deformability [10], the developed copper-based composite possesses a much better deformability. Both the Cu matrix and Fe\ \C particles have a plastic deformation after cold rolling, and a good deformation cooperation of Fe\ \C particles with Cu matrix can be demonstrated by the elongated structure shown in the broken circle of Fig.…”

“…Taking the Cu8Al-alumina composites studied in Ref. [10] as an example, even the compression yield and ultimate tensile strengths can reach 597 ± 7 MPa and 600 ± 7 MPa, respectively, but the elongation is quite low (only 1.0-1.1%). Accordingly, it is quite necessary to improve the deformability of copper-based composites by controlling microstructure or directly develop some other new composites with high strength and high deformability.…”

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

“…However, another factor called 'work of adhesion' exists at the interface that opposes the effect of TR and assists the heat conduction across the Cu/diamond interface. The work of adhesion further depends upon wetting characteristics and bonding between the matrix (Cu) and the filler (diamond) [25,29]. Note that the Cu/D and Cu/CuD composites differ from each other only with respect to the Cu coating of the diamond particles; yet the TR differs by a factor of 1.5.…”