Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

Zain-ul-abdein, Muhammad; Raza, Kabeer; Khalid, Fazal Ahmad; Mabrouki, Tarek

doi:10.1016/j.matdes.2015.07.059

Cited by 47 publications

(11 citation statements)

References 45 publications

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“…Compared to case 1 ( Figure 5 a), cases 2 and 3 demonstrate relatively more irregular temperature profiles for two additional interface related reasons: the thermal resistance and the debonding. Note that a finite value of thermal conductance, 14 kW·m −2 ·K −1 [ 18 ], was used throughout, which resulted in a difference in temperatures across the Cu/diamond interface. Coupled with the difference in CTEs, an uneven expansion of the matrix and the reinforcement led to the interfacial debonding in the absence of ‘cohesion’ between the surfaces.…”

Section: Resultsmentioning

confidence: 99%

“…Since the interfacial debonding can lead to the degradation of material properties, the present work primarily deals with the FE analysis of a Cu/D composite subjected to thermal loading. The initial phases of this work were dedicated to, (i) the fabrication of Cu/D composites using uncoated, Cu-coated (CuD), and Cr-coated diamonds (CrD); (ii) the experimental identification of effective TC and optimization of sintering parameters [ 7 ]; and (iii) the numerical investigation of the effect of the interfacial boundary resistance upon the effective TC [ 18 ].…”

Section: Scope and Methodologymentioning

confidence: 99%

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Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

et al. 2017

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Copper/diamond (Cu/D) composites are famous in thermal management applications for their high thermal conductivity values. They, however, offer some interface related problems like high thermal boundary resistance and excessive debonding. This paper investigates interfacial debonding in Cu/D composites subjected to steady-state and transient thermal cyclic loading. A micro-scale finite element (FE) model was developed from a SEM image of the Cu/20 vol % D composite sample. Several test cases were assumed with respect to the direction of heat flow and the boundary interactions between Cu/uncoated diamonds and Cu/Cr-coated diamonds. It was observed that the debonding behavior varied as a result of the differences in the coefficients of thermal expansions (CTEs) among Cu, diamond, and Cr. Moreover, the separation of interfaces had a direct influence upon the equivalent stress state of the Cu-matrix, since diamond particles only deformed elastically. It was revealed through a fully coupled thermo-mechanical FE analysis that repeated heating and cooling cycles resulted in an extremely high stress state within the Cu-matrix along the diamond interface. Since these stresses lead to interfacial debonding, their computation through numerical means may help in determining the service life of heat sinks for a given application beforehand.

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Section: Resultsmentioning

confidence: 99%

Section: Scope and Methodologymentioning

confidence: 99%

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

et al. 2017

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“…[16,17] Thev alue of the interfacial thermal resistance in composites is typically in the range of 10 À9 to 10 À4 Km 2 W À1 . [12,14,17] Thev alue of R i = 0.010 AE 0.005 Km 2 W À1 reported here is much higher than these typicalv alues,w hich may indicate low adhesion of the polymerm atrixt ot he surface.A nother factor contributing towards the increased interfacial thermal resistance that we observe could be the pores that are present in the polymer but that are not included in the simulation because they cannot be sufficiently distinguished from the matrix.H owever, more detailed measurements and simulations are needed to examine the true origin of this large interfacial resistance. In general, the results show that matrixm aterials for magnetocaloric composites should not only be compared regarding their thermal conductivitya nd mechanical stability,b ut also regarding their interfacial resistance for heat transport to the magnetocaloric material.…”

Section: Resultsmentioning

confidence: 50%

“…Nevertheless, the value of interfacial thermal resistance might depend on the material combination as well as the size and shape of the particles . The value of the interfacial thermal resistance in composites is typically in the range of 10 −9 to 10 −4 K m 2 W −1 . The value of R i =0.010±0.005 K m 2 W −1 reported here is much higher than these typical values, which may indicate low adhesion of the polymer matrix to the surface.…”

Section: Resultsmentioning

confidence: 99%

“…Therebythe influence of the interfacial resistance on the time constant is examined in general and the specific value of R i in the samplec an be determined from the best fit between simulation and experiment. [12] Other methods for the determination of the R i value,a st he direct measurement [13] or the comparison with theoretical models, [14] either need af lat interfaceo rc onductivity measurements for different particlev olume fractions,respectively. Without interfacial thermal resistance (R i = 0) the simulated temperature changeo ver time has as maller time constant than the measurements in bothc ases (Figure 3).…”

Section: Resultsmentioning

confidence: 99%

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Interfacial Thermal Resistance in Magnetocaloric Epoxy‐Bonded La‐Fe‐Co‐Si Composites

et al. 2018

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Magnetocaloric composites made from La−Fe−Co−Si particles and an epoxy binder matrix exhibit mechanical stability and good magnetocaloric properties, but also a large characteristic time for thermal transport. Here, the origin of this large time constant is examined by comparing two measurement techniques, direct and contactless, to finite‐element simulations based on a tomographic dataset of the sample. The combination of the low thermal conductivity of the epoxy matrix and a thermal resistance at the interface between epoxy and La−Fe−Co−Si is shown to be in good agreement in simulations and experiments. The findings help to disentangle the role of the thermal conductivity and the interfacial thermal resistance for the heat flow in magnetocaloric composites. It is shown that the low thermal conductivity of the epoxy alone cannot explain the large time constant and possibilities for using the interfacial thermal resistance to tailor anisotropic thermal conductivity for directional heat transfer in magnetocaloric composites are presented.

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Nanodiamond Coating in Energy and Engineering Fields: Synthesis Methods, Characteristics, and Applications

Zhao,

Song,

Zhang

et al. 2024

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Nanodiamonds are metastable allotropes of carbon. Based on their high hardness, chemical inertness, high thermal conductivity, and wide bandgap, nanodiamonds are widely used in energy and engineering applications in the form of coatings, such as mechanical processing, nuclear engineering, semiconductors, etc., particularly focusing on the reinforcement in mechanical performance, corrosion resistance, heat transfer, and electrical behavior. In mechanical performance, nanodiamond coatings can elevate hardness and wear resistance, improve the efficiency of mechanical components, and concomitantly reduce friction, diminish maintenance costs, particularly under high‐load conditions. Concerning chemical inertness and corrosion resistance, nanodiamond coatings are gradually becoming the preferred manufacturing material or surface modification material for equipment in harsh environments. As for heat transfer, the extremely high coefficient of thermal conductivity of nanodiamond coatings makes them one of the main surface modification materials for heat exchange equipment. The increase of nucleation sites results in excellent performance of nanodiamond coatings during the boiling heat transfer stage. Additionally, concerning electrical properties, nanodiamond coatings elevate the efficiency of solar cells and fuel cells, and great performance in electrochemical and electrocatalytic is found. This article will briefly describe the application and mechanism analysis of nanodiamonds in the above‐mentioned fields.

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Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

Cited by 47 publications

References 45 publications

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Interfacial Thermal Resistance in Magnetocaloric Epoxy‐Bonded La‐Fe‐Co‐Si Composites

Nanodiamond Coating in Energy and Engineering Fields: Synthesis Methods, Characteristics, and Applications

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