Industrial perspective on focused electron beam-induced processes

Bret, T.; Hofmann, Thorsten; Edinger, Klaus

doi:10.1007/s00339-014-8601-2

Cited by 34 publications

(31 citation statements)

References 23 publications

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“…In brief, FEBID decomposes surface physisorbed/chemisorbed precursor molecules under continuous electron beam exposure [8][9][10]. Traditionally, FEBID has been used for the fabrication of protective coatings during transmission electron microscopy (TEM) lamella preparation [8,11], photomask repair [12][13][14], circuit editing [8], or for electrically contacting nanowires or carbon nanotubes [15]. During the last 15 years, dedicated FEBID applications have been demonstrated, such as nanolithography [16,17], stress-strain sensors [18], hall sensors [19], gas sensors [20,21], and others [8,[22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Focused Electron Beam-Based 3D Nanoprinting for Scanning Probe Microscopy: A Review

Plank

Winkler

Schwalb³

et al. 2019

Micromachines

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Scanning probe microscopy (SPM) has become an essential surface characterization technique in research and development. By concept, SPM performance crucially depends on the quality of the nano-probe element, in particular, the apex radius. Now, with the development of advanced SPM modes beyond morphology mapping, new challenges have emerged regarding the design, morphology, function, and reliability of nano-probes. To tackle these challenges, versatile fabrication methods for precise nano-fabrication are needed. Aside from well-established technologies for SPM nano-probe fabrication, focused electron beam-induced deposition (FEBID) has become increasingly relevant in recent years, with the demonstration of controlled 3D nanoscale deposition and tailored deposit chemistry. Moreover, FEBID is compatible with practically any given surface morphology. In this review article, we introduce the technology, with a focus on the most relevant demands (shapes, feature size, materials and functionalities, substrate demands, and scalability), discuss the opportunities and challenges, and rationalize how those can be useful for advanced SPM applications. As will be shown, FEBID is an ideal tool for fabrication/modification and rapid prototyping of SPM-tipswith the potential to scale up industrially relevant manufacturing.

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Section: Introductionmentioning

confidence: 99%

Focused Electron Beam-Based 3D Nanoprinting for Scanning Probe Microscopy: A Review

Plank

Winkler

Schwalb³

et al. 2019

Micromachines

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“…In the so-called Focused Electron Beam Induced Deposition (FEBID) and Focused Ion Beam Induced Deposition (FIBID) techniques, the attained lateral resolution of the deposits is regularly within a few tens of nm, but proof-of-concept experiments have shown resolution as good as 3 nm for the growth of Pt-based dots by FEBID 13 , and 10 nm for the growth of cobalt lines by He + -FIBID 14 . FEBID/FIBID techniques have found applications for the local growth of metal lines used to establish electrical connection between different parts of microelectronic circuits during circuit edit 15,16 , for the restoration of material continuity when repairing defects found in optical masks 17,18 , and, more recently, for the growth of functional materials in the fields of magnetism 19,20 , superconductivity 21 , nano-devices 22 , nano-optics and plasmonics 23,24 , and sensing 25 . In these applications, FEBID and FIBID bring in a high lateral resolution, the capability for three-dimensional growth, the functionality of the deposited material, the tunability of the deposit composition during growth or by post-processing, and the freedom in the choice of substrate.…”

Section: Introductionmentioning

confidence: 99%

Ultra-fast direct growth of metallic micro- and nano-structures by focused ion beam irradiation

Córdoba

Orús

Strohauer

et al. 2019

Sci Rep

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An ultra-fast method to directly grow metallic micro- and nano-structures is introduced. It relies on a Focused Ion Beam (FIB) and a condensed layer of suitable precursor material formed on the substrate under cryogenic conditions. The technique implies cooling the substrate below the condensation temperature of the gaseous precursor material, subsequently irradiating with ions according to the wanted pattern, and posteriorly heating the substrate above the condensation temperature. Here, using W(CO)6 as the precursor material, a Ga+ FIB, and a substrate temperature of −100 °C, W-C metallic layers and nanowires with resolution down to 38 nm have been grown by Cryogenic Focused Ion Beam Induced Deposition (Cryo-FIBID). The most important advantages of Cryo-FIBID are the fast growth rate (about 600 times higher than conventional FIBID with the precursor material in gas phase) and the low ion irradiation dose required (∼50 μC/cm2), which gives rise to very low Ga concentrations in the grown material and in the substrate (≤0.2%). Electrical measurements indicate that W-C layers and nanowires grown by Cryo-FIBID exhibit metallic resistivity. These features pave the way for the use of Cryo-FIBID in various applications in micro- and nano-lithography such as circuit editing, photomask repair, hard masks, and the growth of nanowires and contacts. As a proof of concept, we show the use of Cryo-FIBID to grow metallic contacts on a Pt-C nanowire and investigate its transport properties. The contacts have been grown in less than one minute, which is considerably faster than the time needed to grow the same contacts with conventional FIBID, around 10 hours.

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“…As a result, a deposit is formed. This technique enables the production of free standing 3D nanostructures and is already used commercially for the repair of photolithographic masks [ 4 – 5 ].…”

Section: Introductionmentioning

confidence: 99%

Electron interaction with copper(II) carboxylate compounds

Lacko¹,

Papp²,

Szymańska³

et al. 2018

Beilstein J. Nanotechnol.

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In the present study we have performed electron collision experiments with copper carboxylate complexes: [Cu2(t-BuNH2)2(µ-O2CC2F5)4], [Cu2(s-BuNH2)2(µ-O2CC2F5)4], [Cu2(EtNH2)2(µ-O2CC2F5)4], and [Cu2(µ-O2CC2F5)4]. Mass spectrometry was used to identify the fragmentation pattern of the coordination compounds produced in crossed electron – molecular beam experiments and to measure the dependence of ion yields of positive and negative ions on the electron energy. The dissociation pattern of positive ions contains a sequential loss of both the carboxylate ligands and/or the amine ligands from the complexes. Moreover, the fragmentation of the ligands themselves is visible in the mass spectrum below m/z 140. For the studied complexes the metallated ions containing both ligands, e.g., Cu2(O2CC2F5)(RNH2)+, Cu2(O2CC2F5)3(RNH2)2 + confirm the evaporation of whole complex molecules. A significant production of Cu+ ion was observed only for [Cu2(µ-O2CC2F5)4], a weak yield was detected for [Cu2(EtNH2)2(µ-O2CC2F5)4] as well. The dissociative electron attachment processes leading to formation of negative ions are similar for all investigated molecules as the highest unoccupied molecular orbital of the studied complexes has Cu–N and Cu–O antibonding character. For all complexes, formation of the Cu2(O2CC2F5)4 −• anion is observed together with mononuclear DEA fragments Cu(O2CC2F5)3 −, Cu(O2CC2F5)2 − and Cu(O2CC2F5)−•. All dominant DEA fragments of these complexes are formed through single particle resonant processes close to 0 eV.

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Industrial perspective on focused electron beam-induced processes

Cited by 34 publications

References 23 publications

Focused Electron Beam-Based 3D Nanoprinting for Scanning Probe Microscopy: A Review

Focused Electron Beam-Based 3D Nanoprinting for Scanning Probe Microscopy: A Review

Ultra-fast direct growth of metallic micro- and nano-structures by focused ion beam irradiation

Electron interaction with copper(II) carboxylate compounds

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