Industrial applications of ICB deposition for the fabrication of electronic devices

Yamanishi, K.; Hashimoto, Y.; Tsukazaki, H.

doi:10.1016/0168-583x(95)00048-8

Cited by 3 publications

(2 citation statements)

References 3 publications

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“…Special role belongs to ionised nanometric metal clusters in the free state, used for example, for obtaining thin-film devices with improved and often new properties, which cannot be obtained by means of other methods [1]. In this case these particles should be deposited on different substates at the determined impact energy, size distribution and area density of particles.…”

Section: Introductionmentioning

confidence: 99%

A source of liquid drop metal nanocluster beams: Construction and application

Baranov¹,

Håkansson²,

Kirillov³

et al. 2006

Thin Solid Films

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Section: Introductionmentioning

confidence: 99%

A source of liquid drop metal nanocluster beams: Construction and application

Baranov¹,

Håkansson²,

Kirillov³

et al. 2006

Thin Solid Films

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“…Titanium nitride (TiN), in particular, is one of the most successful materials for industrial applications such as coatings for high-speed steel cutting tools, diffusion barriers in semiconductors, and coatings for decorative. [8][9][10][11][12][13] If the particle surface can be coated with TiN, the powder would gain new properties, and should find applications such as paint elements, polishing powders, and as diffusion barriers in metallurgy.…”

Section: Introductionmentioning

confidence: 99%

Surface Coating on Aluminum Flakes with Titanium Nitride Layer by Barrel-Sputtering Techniques

et al. 2008

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Flake-shaped fine particles were modified with a thin TiN layer by a hexagonal-barrel-sputtering technique. To determine the optimum sputtering conditions, TiN films were deposited on a glass substrate by the reactive sputtering technique by varying the values of N 2 percentage, total pressure, radio-frequency (RF) power, and substrate temperature. From the analysis of XRD patterns, it was determined that a N 2 percentage of 25%, a total pressure of 1.2 Pa, a RF power of 200 W, and room temperature were suitable for the preparation of TiN films. Under these optimized conditions, Al flakes were modified with a TiN by the barrel-sputtering technique. The results of optical microscopy, X-ray diffraction measurements, scanning electron microscopy, and energy-dispersive X-ray spectroscopy measurements revealed that the surface of each Al flake was successfully coated uniformly with a TiN layer.

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Thin Film Deposition and Surface Modification by Cluster Beams

Milani

Iannotta²

1999

Cluster Beam Synthesis of Nanostructured Materials

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Industrial applications of ICB deposition for the fabrication of electronic devices

Cited by 3 publications

References 3 publications

A source of liquid drop metal nanocluster beams: Construction and application

A source of liquid drop metal nanocluster beams: Construction and application

Surface Coating on Aluminum Flakes with Titanium Nitride Layer by Barrel-Sputtering Techniques

Thin Film Deposition and Surface Modification by Cluster Beams

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