Indium-copper multilayer composites for fluxless oxidation-free bonding

Chen, Yi‐Chia; Lee, Chin C.

doi:10.1016/0040-6090(95)08531-9

Cited by 41 publications

(20 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since then, TLP bonding used to join base metals Ag, Au and Cu for electronic packaging and interconnects has been extensively investigated [2,[6][7][8][9][10][11][12][13][14][15][16][17], while that used to join base metals Ni, Pd, Pt and Zr was also reported [18][19][20]. In these efforts, TLP bonding has been be more appropriately termed TLP soldering [2].…”

Section: Introductionmentioning

confidence: 99%

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

2010

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

2010

View full text Add to dashboard Cite

“…A new bonding technique was also reported for a fluxless indium bonding process. [2][3][4] This study focuses on the fluxless solderability of pure indium solder for a chip bonding and fiber attach to chip carrier application. One advantage of pure indium solder is its low melting temperature (156°C).…”

Section: Introductionmentioning

confidence: 99%

Effect of Oxidation on Indium Solderability

Kim

Schoeller

Cho

et al. 2007

Journal of Elec Materi

View full text Add to dashboard Cite

The fluxless solderability of pure indium on gold-coated surfaces is investigated in this study using measurements of wetting angle and joint strength. This study focuses on the effects of indiumÕs native oxides and those which form during heat treatment. The initial oxide thicknesses are obtained by heating indium samples at various temperatures, and then, during the reflow above the melting temperature, oxidation at the interface is either allowed in open air or prevented by reflowing in an inert environment. The testing results presented include characterization of indium oxide (In 2 O 3 ), the effects of indium oxide on joint strength, and the effect of hot pressing during reflow process.

show abstract

“…During the bonding process, the oxide layers on the solder surfaces prevent the In and Sn atoms from diffusing into each other, making it difficult to obtain adequate bonding. 10) Therefore, a flux is normally used during the bonding process to remove the oxide layers. Since the oxide layer can be broken under high bonding pressures, interdiffusion is possible between the Sn and In solders without a flux.…”

Section: Discussionmentioning

confidence: 99%

Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

Chung

Kim

2007

Mater. Trans.

View full text Add to dashboard Cite

We developed a bonding at low temperature using fine pitch Sn and In bumps at 120C, and studied the reliability of the fine pitch In-Sn solder joints. The 30mm pitch Sn and In bumps were joined together without flux at 120C for 2 minutes under 70.2MPa. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test (0C–100C, 2 cycles/h) of up to 2000 cycles and 1000-h temperature and humidity test (40C/95%) were carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. The solder joints were characterized by scanning electron microscopy with energy dispersive X-ray spectroscopy. Joints between the In and Sn bumps were successfully made at 120C. The average contact resistance of the In/Sn solder joints was 10–14m before thermal cycling. Without the NCA, the solder joints between the Si chip and glass substrate failed electrically in the early stages of the thermal cycling test. The failure in the solder joint during thermal cycling was attributed to the thermal expansion mismatch between the Si chip and glass substrate. In contrast, no electrical failures were observed in the joints with applied NCA even after 2000 cycles. The flip chip joints with applied NCA were stable up to 1000 hours in the temperature and humidity test. [doi:10.2320/matertrans.48.37

show abstract

Indium-copper multilayer composites for fluxless oxidation-free bonding

Cited by 41 publications

References 7 publications

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

Effect of Oxidation on Indium Solderability

Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

Contact Info

Product

Resources

About