Abstract:We developed a bonding at low temperature using fine pitch Sn and In bumps at 120C, and studied the reliability of the fine pitch In-Sn solder joints. The 30mm pitch Sn and In bumps were joined together without flux at 120C for 2 minutes under 70.2MPa. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test (0C–100C, 2 cycles/h) of up to 2000 cycles and 1000-h temperature and humidity test (40C/95%) were carried out to evaluate the reliability of the solder joints. The bondabili… Show more
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