The magnetoresistance of avalanching semiconductor diodes is analyzed in terms of the Lorentz force acting on a Maxwellian distribution of carriers, assuming a scattering mechanism characterized by a constant mean free path. At low current levels, the magneto‐resistance only arises in the generation region close to the junction interface, and is a result of the reduction in the hot carrier temperature caused by the deflection of the carriers from their original trajectories. The fractional change in the maximum field strength in the junction to maintain the carrier temperature at its original value is shown to be ΔEm/Em = 0.388 (μ(Em) H)2 where μ(Em) is the conductivity mobility corresponding to the average scattering rate of carriers in equilibrium with the maximum field in the junction. This magnetoresistance may be determined through measurement of the change in reverse bias required to maintain a constant avalanche current through the device. At high current levels a correction must be made for the magnetoresistance of the bulk semiconductor in series with the exhaustion region. From measurements on a series of diodes with different breakdown field strengths, it is possible to measure the field dependence of the scattering rate of the majority carriers on the lower doped side of the junction at field strengths of interest in device operation. The predictions of the paper are in good agreement with experimental observations.