2016
DOI: 10.1149/2.1121605jes
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In-Situ Monitoring of Alloy Dissolution and Residual Film Formation during the Pretreatment of Al-Alloy AA2024-T3

Abstract: The dissolution of intermetallic phases in AA 2024-T3 aluminum alloy sheet was investigated during a coating pretreatment sequence. The atomic emission spectroelectrochemistry (AESEC) technique was used to quantitatively measure the dissolution rates of individual alloying elements during a complete pretreatment sequence. The results demonstrate the significant selective dissolution of Al in 1.25 M NaOH, leading to the enrichment of alloying elements such as Cu. Subsequent 2.8 M HNO 3 treatment contributes tow… Show more

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Cited by 27 publications
(13 citation statements)
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“…A simulation of a complete pretreatment sequence is shown in Figure 11, in this case involving NaOH/water rinse/HNO 3 under the conditions indicated in the figure. 69 The results demonstrate the intense Al dissolution in alkaline solution, followed by the dissolution of residual Cu and the passivation of the Al in the nitric acid step. The quantitative aspects of AESEC are well illustrated: Al dissolution was rapid in the alkaline solution corresponding to an etching rate of approximately 160 μg/h.…”
Section: Accumulation Of Cu and Other Elementsmentioning
confidence: 87%
See 1 more Smart Citation
“…A simulation of a complete pretreatment sequence is shown in Figure 11, in this case involving NaOH/water rinse/HNO 3 under the conditions indicated in the figure. 69 The results demonstrate the intense Al dissolution in alkaline solution, followed by the dissolution of residual Cu and the passivation of the Al in the nitric acid step. The quantitative aspects of AESEC are well illustrated: Al dissolution was rapid in the alkaline solution corresponding to an etching rate of approximately 160 μg/h.…”
Section: Accumulation Of Cu and Other Elementsmentioning
confidence: 87%
“…The red dashed curve shows the RTD for the flow cell under the conditions of these experiments. Modified from Gharbi, et al,69 under CC-BY-NC-ND license.…”
mentioning
confidence: 99%
“…It is known that the deposition of Ce-oxides proceeds at the cathodic sites at the surface which are, in the case of AA7075-T6, Cu-containing intermetallic particles (IMPs). [54][55][56][57][58][59] The fact that no Cu could be identified at the intermetallic particles proves that the deposits of Ce hydroxide/oxide are thicker than is the EDS analysis depth, i.e. several micrometers.…”
Section: Resultsmentioning
confidence: 99%
“…A cuprous (n = 1) assumption provided the best match between mass loss and derived anodic charge obtained independently from EIS measurements and corroborated by prior work. 30,38,44,45 Electrochemical impedance measurements on CuAl samples exposed to artificial perspiration also revealed Cu-2Al had the greatest corrosion rate (1/R p α i corr , Figure 12a). Cu and the other Cu-Al alloys had similar mass loss at 96 h. affect anodic kinetics.…”
Section: Soluble Corrosion Products -Icp-oes-soluble Release Of Cu Amentioning
confidence: 95%