In situ measurement for resist thickness control and development endpoint detection

Temmel, G.; Roeder, G.; Ryssel, H.

doi:10.1016/0167-9317(92)90067-2

Cited by 1 publication

(1 citation statement)

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“…Hence, optical in situ metrology for resist thickness measurements and endpoint detection in resist development was developed. Singlewavelength and spectroscopic reflectometry were applied and tested by different groups (4)(5)(6). At the Fraunhofer IISB, a robust in situ spectroscopic reflectometer setup enabling fast resist thickness measurements and endpoint detection in development processes was developed (Figure 4).…”

Section: Application Of Spectral Reflectometry For the Control Of Res...mentioning

confidence: 99%

Process Optimization by Means of Integrated Monitoring Tools in the Semiconductor Industry

Pfitzner

Nutsch²,

Roeder³

et al. 2007

ECS Trans.

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Semiconductor manufacturing still follows Moorés Law, stating a cost reduction of approximately 25 to 30 % per year, a value actu-ally achieved in the past 40 years. One of the key enablers for fur-ther continuation of Moore's Law will be a much tighter process control. This paper describes aspects of Advanced Process Control and especially of integrated metrology, the foundation of process optimization by means of integrated process monitoring tools. Shortest response time requires that measurement methods have to be engineered as near as possible to the process itself, thus reduc-ing the time between processes, measurement and corrective ac-tions. Such integrated metrology is realized as in-line metrology, in situ metrology or virtual metrology. This paper presents the devel-opment of sensors, their integration and results for control of resist processing in lithography, use of according sensors for the control and endpoint detection in CMP processes, and novel methods for geometrical metrology in CMP process monitoring.

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Section: Application Of Spectral Reflectometry For the Control Of Res...mentioning

confidence: 99%

Process Optimization by Means of Integrated Monitoring Tools in the Semiconductor Industry

Pfitzner

Nutsch²,

Roeder³

et al. 2007

ECS Trans.

View full text Add to dashboard Cite

show abstract

In situ measurement for resist thickness control and development endpoint detection

Cited by 1 publication

References 3 publications

Process Optimization by Means of Integrated Monitoring Tools in the Semiconductor Industry

Process Optimization by Means of Integrated Monitoring Tools in the Semiconductor Industry

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