“…A group of low melting point metals, including tin (Sn) [22][23][24][25], indium (In) [23,26,27], gallium (Ga) [28] and bismuth (Bi) [29], have been adopted to mediate the VLS growth of SiNWs in a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. In this way, we have demonstrated Sn assisted SiNW growth at a substrate temperature as low as 240 1C [23], with yet a very important bonus that after growing the SiNWs into a desired length, the remnant Sn can be removed by a simple hydrogen (H 2 ) plasma etching without the need of any ex situ cleaning [30].…”