“…2,12,16,17 Because, these techniques have flexibity with respect to controlling growth parameters in research of SiGebased high-performance devices. [1][2][3][4][5][6] In most of the works, 3,6,7,10,11,13-16 the phosphine (PH 3 ) has been reported to be prerequisite doping gas source to provide high-quality n-region with steep and narrow doping profile in high-performance SiGe HBTs and MOSFETs. Since the cracking temperature of PH 3 gas is about 300 • C, 3 the P doping of SiGe is being at atomic level at very low temperatures, not higher than 550 • C. 10,14 The stages in the doping process of SiGe by phosphine can be ordered as PH 3 adsorption and PH 3 decomposition on the surface, P desorption and P incorporation from the surface to the grown SiGe film.…”