Semiconductor Materials Analysis and Fabrication Process Control 1993
DOI: 10.1016/b978-0-444-89908-8.50064-7
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In situ bulk lifetime measurement on silicon with a chemically passivated surface

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Cited by 112 publications
(16 citation statements)
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“…Before measuring the lifetime using the QSSPC technique, the as-grown samples were subjected to a polishing etch containing HNO 3 , HF and CH 3 COOH (removal of 20 mm from each side of the wafer) and a subsequent surface clean by Piranha solution (H 2 O 2 :H 2 SO 4 ¼1:4) followed by an HF-Dip. The surface was passivated using an iodine/ethanol solution [13]. Electron back scattered diffraction (EBSD) and transmission electron microscope (TEM) were used to study the grain-structure, -orientation, and -morphology as well as structural defects.…”
Section: Methodsmentioning
confidence: 99%
“…Before measuring the lifetime using the QSSPC technique, the as-grown samples were subjected to a polishing etch containing HNO 3 , HF and CH 3 COOH (removal of 20 mm from each side of the wafer) and a subsequent surface clean by Piranha solution (H 2 O 2 :H 2 SO 4 ¼1:4) followed by an HF-Dip. The surface was passivated using an iodine/ethanol solution [13]. Electron back scattered diffraction (EBSD) and transmission electron microscope (TEM) were used to study the grain-structure, -orientation, and -morphology as well as structural defects.…”
Section: Methodsmentioning
confidence: 99%
“…It is experimentally very difficult to uniquely separate the contribution of the silicon ILD lifetime from the contribution of the rest of the cell to the cell performance. In this work, QSSPC ILD lifetime data are measured on both (i) the ingot from which wafers were sawn and processed into PERC cells and (ii) the actual wafer after acid stripping the cell and passivating with iodine . There are numerous issues with both approaches.…”
Section: Boundary + Injection‐level‐dependent Lifetime Model Applied mentioning
confidence: 99%
“…The wet process has been improved in terms of lifetime measurement by changing the cleaning conditions with an iodine-ethanol passivation technique. 14 Controlling the interface properties during a-Si deposition is also important. Even if we used the same quality a-Si layers, we would have obtained different cell properties due to plasma damage during the deposition.…”
Section: Reduction Of Interface State Densitymentioning
confidence: 99%