In-Plane and Out-of-Plane MEMS Gyroscopes Based on Piezoresistive NEMS Detection

Dellea, Stefano; Giacci, Federico; Longoni, A.; Langfelder, Giacomo

doi:10.1109/jmems.2015.2441142

Cited by 50 publications

(21 citation statements)

References 27 publications

(30 reference statements)

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“…The future roadmap to very low noise gyroscopes is currently not set, and several alternative approaches are researched. Without abandoning the mechanical structure of the tuning-fork Coriolis gyroscope, an improvement in noise floor has been demonstrated for piezoresistive, instead of electrostatic, detection [19]. Piezoresistive sensing, however, comes with its own problems of linearity and temperature stability.…”

Section: High-reliable Non-volatile Memoriesmentioning

confidence: 99%

Limits of sensing and storage electronic components for high-reliable and safety-critical automotive applications

Pieri

Zambelli

Nannini

et al. 2017

2017 International Conference of Electrical and Electronic Technologies for Automotive

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The paper critically reviews the limits, for safety-critical automotive applications, of state-of-art technologies for nonvolatile memory data/instruction storage and MEMS inertial sensors. Some hints, supported by theoretical analysis and/or experimental measures, to overcome these issues are provided. The reliability limits of plastic packages, typically adopted to keep low the device cost in the large volume automotive market, are also discussed. By exploiting a Fault Tree Analysis, the packaging bottlenecks are highlighted and proper countermeasures at circuit and technology level are proposed.

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Section: High-reliable Non-volatile Memoriesmentioning

confidence: 99%

Limits of sensing and storage electronic components for high-reliable and safety-critical automotive applications

Pieri

Zambelli

Nannini

et al. 2017

2017 International Conference of Electrical and Electronic Technologies for Automotive

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show abstract

“…SiNW piezoresistive inertial sensors have been proposed. (18,19) Similar to previous studies, (11,12) SiNWs are formed on a thin SOI wafer, and the epitaxy silicon process is performed to form microscale sensor structures. Since SiNWs are buried at the bottom of microscale structures, additional processes are required to access the SiNWs.…”

Section: Introductionmentioning

confidence: 98%

Top-down Fabrication of Silicon Nanowires Using Thermal Oxidation and Wet Etching for Inertial Sensor Applications

Jang¹,

Lee²,

Shin³

et al. 2018

Sensors and Materials

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In this paper, we present a new top-down fabrication method of silicon nanowires (SiNWs) for inertial sensor applications. Recently, SiNW piezoresistive inertial sensors have attracted much attention because they can provide high sensitivities and high signal-to-noise ratios. For manufacturable inertial sensors based on SiNWs, the dimensions of SiNWs need to be reproducible and controllable. SiNWs should also be integrated with microscale structures and circuits. In the developed method, the width and thickness of SiNWs were controlled by thermal oxidation and silicon wet etching, respectively. SiNWs can be integrated with microscale structures, which were also fabricated by deep reactive ion etching and silicon wet etching. The width and thickness of the fabricated SiNWs were in the range of 65-163 and 56-131 nm, respectively. The reproducibility of SiNWs was also evaluated. The maximum standard deviation of the width of SiNWs was 30 nm, and that of the thickness was 46 nm. These results show that the SiNW dimensions are reproducible and that they can be accurately controlled.

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“…The working of vibratory MEMS gyroscopes is dependent on the Coriolis effect which requires oscillations of the proof mass to be sustained in the drive axis and a sensing mechanism for the measurement of displacement of the proof mass corresponding to an input rotation. In MEMS gyroscopes, the oscillations in the proof mass and sensing of its displacement are achieved by using different transduction mechanisms including electrostatic [ 1 ], electrothermal [ 2 ], piezoelectric [ 3 ], piezoresistive [ 4 ] and optical [ 5 ]. Among these transduction mechanisms, the electrostatic is most commonly used due its fast response time, low power consumption¸ ease of fabrication and integration with the drive and readout electronics [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

et al. 2020

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This paper presents microfabrication process-driven design of a multi-degree of freedom (multi-DoF) non-resonant electrostatic microelectromechanical systems (MEMS) gyroscope by considering the design constraints of commercially available low-cost and widely-used silicon-on-insulator multi-user MEMS processes (SOIMUMPs), with silicon as a structural material. The proposed design consists of a 3-DoF drive mode oscillator with the concept of addition of a collider mass which transmits energy from the drive mass to the passive sense mass. In the sense direction, 2-DoF sense mode oscillator is used to achieve dynamically-amplified displacement in the sense mass. A detailed analytical model for the dynamic response of MEMS gyroscope is presented and performance characteristics are validated through finite element method (FEM)-based simulations. The effect of operating air pressure and temperature variations on the air damping and resulting dynamic response is analyzed. The thermal stability of the design and corresponding effect on the mechanical and capacitive sensitivity, for an operating temperature range of −40 °C to 100 °C, is presented. The results showed that the proposed design is thermally stable, robust to environmental variations, and process tolerances with a wide operational bandwidth and high sensitivity. Moreover, a system-level model of the proposed gyroscope and its integration with the sensor electronics is presented to estimate the voltage sensitivity under the constraints of the readout electronic circuit.

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In-Plane and Out-of-Plane MEMS Gyroscopes Based on Piezoresistive NEMS Detection

Cited by 50 publications

References 27 publications

Limits of sensing and storage electronic components for high-reliable and safety-critical automotive applications

Limits of sensing and storage electronic components for high-reliable and safety-critical automotive applications

Top-down Fabrication of Silicon Nanowires Using Thermal Oxidation and Wet Etching for Inertial Sensor Applications

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

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