The photonic crystal InGaN/GaN light emitting diodes ͑LEDs͒ on thin silicon-on-insulator ͑SOI͒ substrates are demonstrated. Surface nanopatterning has been carried out on such LED layers and the processing conditions are varied to improve the outcoupling of visible emission. A substantial increase in the photoluminescence intensity is observed from LEDs on a thin SOI overlayer as compared to a similar structure grown on a thicker SOI. In addition, enhancement of the cathodoluminescence and electroluminescence intensity from such photonic crystal LEDs shows their potential in solid-state lighting.According to the present solid-state lighting research, the luminescence efficiency of InGaN/GaN light emitting diodes ͑LEDs͒ can reach 80%. 1 Major LED manufacturing companies now focus on the development of high power and high brightness devices with suitable packaging for general illumination market. 1-3 An alternate low cost solution for street lighting and general illumination for GaN LEDs could be the use of large-area Si-based substrates. 4,5 One of the major concerns for the LEDs on Si substrate is the absorption of blue-green light emitted from InGaN/GaN multiquantum well ͑MQW͒ active layers. In this context, substrate removal is a necessary step to realize high brightness LEDs. An alternate solution is to grow LED structures on a large-area, thin reflective Si-on-insulator ͑SOI͒ substrates. 6,7 Recently, majority of research groups have been exploring two-dimensional ͑2D͒ photonic crystal ͑PhC͒ structures to improve the light-extraction efficiency ͑LEE͒ for high brightness LEDs. [8][9][10][11][12][13][14][15] In this study, we have carried out surface nanopatterning to enhance light emission from GaN-based LEDs on large-area silicon-based substrates. The LEDs with photonic nanostructures on thin SOI show substantial photoluminescence ͑PL͒, cathodoluminescence ͑CL͒, and electroluminescence ͑EL͒ intensity enhancement.The InGaN/GaN LEDs were grown by metallorganic chemical vapor deposition on SOI͑111͒ substrates with SOI overlayer thickness in the range of 45 to 200 nm with a buried oxide ͑BOX͒ thickness ranging from 150 to 375 nm. The full LED structure consisted of a high temperature buffer layer, an Al-rich intermediate layer, a 2.75 m n-type thick Si-doped GaN, five periods of InGaN/ GaN MQWs, and a 120 nm Mg-doped p-type GaN layer. For the light extraction study, we used two sets of LED samples, where layers were grown on thin SOI ͑45-50 nm overlayer with 150 nm BOX: green emission ϳ525 nm͒ and thick SOI ͑200 nm overlayer with 375 nm BOX: emission ϳ485 to 490 nm͒ substrates. The fabrication of 2D PhC structures on the LED surfaces was carried out by electron-beam lithography and dry etching of GaN using a SiO 2 nanomask. 7 The microscopic PL and EL spectra were recorded from the PhC structures using a Jobin Yvon LABRAM setup equipped with 325 nm excitation from a He-Cd laser. The low temperature CL measurements were carried out in a JEOL scanning electron microscope ͑SEM͒ equipped with a helium cryostat. To de...