Abstract:A new simple model for profiling the impurities within a shallow p‐n junction from spreading resistance data is proposed. Dickey's capacitance analogue method is extended to a “multilayer” geometry. Direct translation of the differential sheet conductance method to the spreading resistance method is performed. As examples of this approach, the cases of shallow boron (11B+)‐, phosphorus (31P+)‐, and arsenic (As)‐doped layers in silicon are discussed.
“…The trends indicate that the effects of nonideal contact phenomena, such as barrier potentials, and piezoresistance, increase with increasing surface damage. The nonlinearity in the calibration curve can be compensated by including an empirical barrier resistance into the correction algorithm (2,6).…”
Section: Discussionmentioning
confidence: 99%
“…Each layer is assumed to have uniform concentration and finite thickness, equal to ~ the distance between measurement points. If a p-n junction exists within one probe radius of the surface then a differential spreading resistance technique, analgous to fourpoint probe incremental sheet resistance, can be applied (5,6). The resulting correction factors are explicit functions of the profile slope .and are fairly accurate for Shallow structures.…”
An efficient implementation of multilayer potential analysis for spreading resistance measurements is described. A precalculated partial integral technique reduces computation time by a factor of 20 with no significant loss of accuracy. Spreading resistance measurements on beveled samples are compared to spreading resistance and four‐point probe measurements on anodically sectioned samples and to Schottky C‐V measurements. The results demonstrate the accuracy, versatility, and limitations of the technique.
“…The trends indicate that the effects of nonideal contact phenomena, such as barrier potentials, and piezoresistance, increase with increasing surface damage. The nonlinearity in the calibration curve can be compensated by including an empirical barrier resistance into the correction algorithm (2,6).…”
Section: Discussionmentioning
confidence: 99%
“…Each layer is assumed to have uniform concentration and finite thickness, equal to ~ the distance between measurement points. If a p-n junction exists within one probe radius of the surface then a differential spreading resistance technique, analgous to fourpoint probe incremental sheet resistance, can be applied (5,6). The resulting correction factors are explicit functions of the profile slope .and are fairly accurate for Shallow structures.…”
An efficient implementation of multilayer potential analysis for spreading resistance measurements is described. A precalculated partial integral technique reduces computation time by a factor of 20 with no significant loss of accuracy. Spreading resistance measurements on beveled samples are compared to spreading resistance and four‐point probe measurements on anodically sectioned samples and to Schottky C‐V measurements. The results demonstrate the accuracy, versatility, and limitations of the technique.
“…Kudoh et aL recently developed a simple method for profiling the impurities within a shallow p-n junction by spreading-resistance probe technique (5). In the present study, this newly developed technique has been applied to obtain carrier distributions in 7~As+implanted layers after steam oxidations at temperatures below 1000~ and thus to provide processing data for short-channel MOS or shallow junction bipolar IC's.…”
Carrier distribution in 150 keV, 1016/cm 2 ~As+-implanted Si layer after steam oxidation in the 850~176 temperature range has been measured by the spreading-resistance probe technique. When the oxidation temperature is below 1000~ the carrier distribution shifts toward the surface at the initial stage of oxidation due to the Si-SiO2 interface movement, and sheet resistance increases correspondingly. After the initial stage, the carrier distribution then spreads gradually, corresponding to a slowing down in the oxidation rate. In contrast, when the oxidation temperature is above 1000~ As diffusion effects dominate, and t~he carrier distribution spreads into Si and sheet resistance decreases monotonically with increasing oxidation time. These behaviors have been explained by simple numerical calculations.
A simple model is derived to determine steep doping profiles on a low‐resistance substrate from spreading resistance measurements on a bevel edge. Dickey's capacitance analogue method which is concerned with a homogeneously doped thin layer on a conducting boundary is extended to a multilayer geometry. This approximation is discussed for the example of autodoping profiles in thin silicon epitaxial layers on highly arsenic‐doped silicon substrates.
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