2009
DOI: 10.1117/12.825273
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Improving radiation tolerance in e2v CCD sensors

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Cited by 17 publications
(20 citation statements)
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“…Dopant Region P P P P P P P P P P P P P P P P P P Phosphorus dopant atoms Figure 2. Radiation damage mechanism for a high energy proton in a CCD (adapted from [7]). …”
Section: Radiation Damage and Charge Transfer Inefficiency (Cti)mentioning
confidence: 99%
“…Dopant Region P P P P P P P P P P P P P P P P P P Phosphorus dopant atoms Figure 2. Radiation damage mechanism for a high energy proton in a CCD (adapted from [7]). …”
Section: Radiation Damage and Charge Transfer Inefficiency (Cti)mentioning
confidence: 99%
“…Our original interpretation 26 of the cause was because of the formation of trapped holes in the oxide being compensated by electrons trapped in the Si3N4 (of the Si3N4-SiO2 gate dielectric), thereby resulting in a lower flatband shift described by Saks et al 1979 27 . However, this original interpretation was incorrect because e2v n-channel CCDs also benefit from this process 25 .…”
Section: Resultsmentioning
confidence: 99%
“…The onset of blooming occurs around 300 rows earlier than in the control region, and indicates a decrease in the SatLin of around 50k holes. The reduction in full well is likely to be the resulting flatband voltage which occurs during the irradiation, in e2v n-channel CCDs this is typically 100-200 mV per krad 13 for a standard gate CCD (for example the p-channel and n-channel CCD204) 25 . The total ionising dose (TID) delivered during the irradiation was 65 krad.…”
Section: Resultsmentioning
confidence: 99%
“…Through carefully choosing the device temperature or the way in which the device is operating, it has been shown that the effect of the radiation-induced traps can be reduced dramatically [42,43]. The third method involves the correction of smeared images through post-processing [36,44,45], as shown in Figure 1, making use of models of the charge transfer in the CCD in the presence of traps [44][45][46][47]. This correction is usually required alongside the optimisation of the device design and device operation to reach the level of correction required.…”
Section: Motivationmentioning
confidence: 99%