Improvements of Solder Ball Shear Strength of a Wafer-Level CSP Using a Novel Cu Stud Technology

Characterization of the shear test method with low melting point In–48Sn solder joints

“…The averaged incremental equivalent plastic strain analysis was performed in determining the failure mode of the solder ball under the shear test, because the load on the pad site of the solder ball during a shear test is a mixture of tensile, shear and compressive forces, especially at the corners of the solder [18]. Fig.…”

Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

“…The equivalent plastic strain was used because the load on the Ni-P mini bump of the solder joint during a shear test is a mixture of tensile, shear, and compressive forces, especially at the corners of the solder. 14 From Fig. 3a, the high plastic strain region in the solder ball was near the contact point between the shear ram and the solder, and subsequently expanded through the solder in parallel to the chip surface.…”

Reexamination of the solder ball shear test for evaluation of the mechanical joint strength

“…In determining the failure mode of the solder ball under shear testing, analysis of the averaged incremental equivalent plastic strain was performed, because the load on the pad site of the solder ball during a shear test is a mixture of tensile, shear and compressive forces, especially at the corners of the solder (Chang and Chiang, 2004). Fig.…”